DISCRETE SEMICONDUCTORS DATA SHEET M3D124 BFG21W UHF power transistor Product specification Supersedes data of 1997 Nov 21 1998 Jul 06
NXP Semiconductors Product specification UHF power transistor BFG21W FEATURES PINNING High power gain PIN High efficiency 1, 3 DESCRIPTION emitter 1.9 GHz operating area 2 base Linear and non-linear operation. 4 collector APPLICATIONS Common emitter class-AB output stage in hand held radio equipment at 1.9 GHz such as DECT, PHS, etc. handbook, halfpage 3 4 2 1 Driver for DCS1800, 1900.
NXP Semiconductors Product specification UHF power transistor BFG21W LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter 15 V VCEO collector-emitter voltage open base 4.
NXP Semiconductors Product specification UHF power transistor BFG21W CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V(BR)CBO collector-base breakdown voltage open emitter; IC = 0.1 mA 15 V V(BR)CEO collector-emitter breakdown voltage open base; IC = 10 mA 4.5 V V(BR)CER collector-emitter breakdown voltage RBE < 1 k, IC = 10 mA 10 V V(BR)EBO emitter-base breakdown voltage open collector; IE = 0.
NXP Semiconductors Product specification UHF power transistor handbook, full pagewidth BFG21W VC VS R1 L5 R2 C7 R3 C6 TR1 C3 L4 L1 RF input 50 Ω L3 C5 L2 C1 RF output 50 Ω DUT C4 C2 MGM221 Fig.4 Common emitter test circuit for class-AB operation at 1.9 GHz. List of components used in test circuit (see Figs 4 and 5) COMPONENT C1, C5 DESCRIPTION VALUE multilayer ceramic chip capacitor; note 1 DIMENSIONS CATALOGUE No. 24 pF C2 multilayer ceramic chip capacitor; note 1 3.
NXP Semiconductors Product specification UHF power transistor BFG21W 45 handbook, full pagewidth 35 VS VC R1 TR1 L5 R2 R3 C3 C7 C6 L1 L4 C2 C1 C5 L2 L3 input DUT C4 output MGM222 Dimensions in mm. The components are situated on one side of the copper-clad PTFE fibre-glass board, the other side is unetched and serves as a ground plane. Earth connections from the component side to the ground plane are made by through metallization. Fig.
NXP Semiconductors Product specification UHF power transistor BFG21W MGM223 MGM224 16 L (Ω) 12 10 Zi handbook, Z halfpage handbook, halfpage (Ω) ri 8 RL 8 6 4 xi 4 0 2 0 1.8 1.85 1.9 1.95 f (GHz) −8 1.8 2.0 Input impedance as function of frequency (series components); typical values. 1998 Jul 06 1.85 1.9 1.95 f (GHz) 2.0 VCE = 3.6 V; ICQ = 1 mA; PL = 26 dBm; Ts 60 C. VCE = 3.6 V; ICQ = 1 mA; PL = 26 dBm; Ts 60 C. Fig.6 XL −4 Fig.
NXP Semiconductors Product specification UHF power transistor BFG21W PACKAGE OUTLINE Plastic surface-mounted package; reverse pinning; 4 leads D SOT343R E B A X HE y v M A e 3 4 Q A A1 c 2 w M B 1 bp Lp b1 e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.4 0.3 0.7 0.5 0.25 0.10 2.2 1.8 1.35 1.15 1.3 1.15 2.2 2.0 0.45 0.15 0.23 0.13 0.2 0.2 0.
NXP Semiconductors Product specification UHF power transistor BFG21W DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Product specification UHF power transistor BFG21W Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s).
NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.
