Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLinear ICsBGA7024,135

1. Product profile

1.1 General description

The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount

package. It delivers 24 dBm output power at 1 dB gain compression and superior

performance up to 2700 MHz.

1.2 Features and benefits

 400 MHz to 2700 MHz frequency operating range

 16 dB small signal gain at 2 GHz

 24 dBm output power at 1 dB gain compression

 Integrated active biasing

 External matching allows broad application optimization of the electrical performance

 5 V single supply operation

 All pins ESD protected

1.3 Applications

1.4 Quick reference data

[1] Operation outside this range is possible but not guaranteed.

[2] P

= 11 dBm per tone; spacing = 1 MHz.

BGA7024

400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier

Rev. 3 — 11 June 2014 Product data sheet





 Broadband CPE/MoCA  Industrial applications

 WLAN/ISM/RFID  E-metering

 Wireless infrastructure (base station,

repeater, point-to-point backhaul systems)

 Satellite Master Antenna TV (SMATV)

Table 1. Quick reference data

Input and output impedances matched to 50



. Typical values at V

=5V; T

case

=25



unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

supply current 95 110 125 mA

f frequency

[1]

400 - 2700 MHz

power gain f = 2140 MHz 13.5 15 16.5 dB

L(1dB)

output power at 1 dB gain compression f = 2140 MHz 24.0 25.5 - dBm

IP3

output third-order intercept point f = 2140 MHz

[2]

35.0 38.5 - dBm

Summary of content (23 pages)

PAGE 1
62 7 BGA7024 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Rev. 3 — 11 June 2014 Product data sheet 1. Product profile 1.1 General description The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount package. It delivers 24 dBm output power at 1 dB gain compression and superior performance up to 2700 MHz. 1.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1 VCC(RF) [1] 2 GND [2] 3 RF_IN [1] Graphic symbol V\P [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC(RF) RF supply voltage - 5.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Table 7. Dynamic characteristics …continued Input and output impedances matched to 50 . Typical values at VCC = 5 V; Tcase = 25 C; see Section 12 “Application information”; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit PL(1dB) f = 940 MHz - 24 - dBm f = 1960 MHz - 25.5 - dBm f = 2140 MHz 24.0 25.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Table 8. Scattering parameters at 5 V, MMIC only …continued f (MHz) S11 S21 S12 S22 Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) 1400 0.89 154.8 4.43 66.17 0.03 43.58 0.61 166.4 1500 0.89 153 4.09 63.33 0.03 43.02 0.62 164.7 1600 0.89 151.3 3.80 60.8 0.03 42.67 0.63 163.1 1700 0.90 149.9 3.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 12. Application information 12.1 920 MHz to 960 MHz C7 R1 J3 VCC C6 C8 L3 L2 50 Ω MSL1 C1 C9 MSL2 MSL3 J1 RF_IN C3 C2 MSL4 VCC(RF) MSL5 L1 C5 MSL6 50 Ω J2 C4 BGA7024 014aab021 See Table 11 for a list of components. PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m. Fig 2.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 014aab024 0 014aab025 42 IP3O (dBm) RLin, RLout, ISL (dB) 40 (1) −10 (2) (3) 38 (1) 36 −20 (2) 34 (3) −30 0.92 0.93 0.94 0.95 32 0.92 0.96 0.93 0.94 0.95 f (GHz) 0.96 f (GHz) Tcase = 25 C. (1) Tcase = 40 C. (1) RLin (2) Tcase = 25 C. (2) RLout (3) Tcase = 85 C. (3) ISL Fig 5. Input return loss, output return loss and isolation as a function of frequency Fig 6.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Table 11. 5 V application list of components; 920 MHz to 960 MHz See Figure 2 and Figure 7 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 m. Component Description Value Function Remarks C1, C5 capacitor 68 pF DC blocking Murata GRM1885C1H680JA01D C2 capacitor 3.9 pF input match Murata GRM1885C1H3R9CZ01D C3 capacitor 3.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 014aab028 30 014aab029 20 PL(1dB) (dBm) Gp (dB) 28 18 (1) (2) (1) 26 16 (2) (3) (3) 24 14 22 12 20 1.93 1.95 1.97 1.99 10 1.93 1.95 1.97 f (GHz) (1) Tcase = 40 C. (1) Tcase = 40 C. (2) Tcase = 25 C. (2) Tcase = 25 C. (3) Tcase = 85 C. (3) Tcase = 85 C. Fig 9. Output power at 1 dB gain compression as a function of frequency 014aab030 0 1.99 f (GHz) Fig 10.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier GND GND VCC GND GND GND J3 C7 R1 C6 J1 J2 MSL4 MSL3 C5 MSL5 L1 MSL1 C1 MSL6 MSL2 C2 J I HGF EDCBA C4 MSL7 C3 1 2 3 4 5 6 7 8 9 10 12 11 13 RF in RF out 014aab032 See Table 12 for a list of components. Fig 13. 5 V application reference board; 1930 MHz to 1990 MHz BGA7024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Table 12. 5 V application list of components; 1930 MHz to 1990 MHz See Figure 8 and Figure 13 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 m. Component Description Value Function Remarks C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D C2 capacitor 2.4 pF input match Murata GRM1885C1H2R4CZ01D C3 capacitor 1.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 014aab034 30 014aab035 20 PL(1dB) (dBm) Gp (dB) 28 18 (1) (2) (1) 26 16 (2) (3) (3) 24 14 22 12 20 2.11 2.13 2.15 2.17 10 2.11 2.13 2.15 f (GHz) (1) Tcase = 40 C. (1) Tcase = 40 C. (2) Tcase = 25 C. (2) Tcase = 25 C. (3) Tcase = 85 C. (3) Tcase = 85 C. Fig 15. Output power at 1 dB gain compression as a function of frequency 014aab036 0 2.17 f (GHz) Fig 16.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier GND GND VCC GND GND GND J3 C7 R1 C6 J1 J2 MSL4 MSL3 C5 MSL5 L1 MSL1 C1 MSL6 MSL2 C2 J I HGF EDCBA C4 MSL7 C3 1 2 3 4 5 6 7 8 9 10 12 11 13 RF in RF out 014aab038 See Table 13 for a list of components. Fig 19. 5 V application reference board; 2110 MHz to 2170 MHz BGA7024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Table 13. 5 V application list of components; 2110 MHz to 2170 MHz See Figure 14 and Figure 19 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 m. Component Description Value Function Remarks C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D C2 capacitor 2.2 pF input match Murata GRM1885C1H2R2CZ01D C3 capacitor 1.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 014aab040 30 014aab041 20 PL(1dB) (dBm) Gp (dB) 28 18 26 16 (1) (1) 24 14 (2) (2) (3) 22 (3) 12 20 2.405 2.425 2.445 2.465 2.485 f (GHz) 10 2.405 2.425 (1) Tcase = 40 C. (1) Tcase = 40 C. (2) Tcase = 25 C. (2) Tcase = 25 C. (3) Tcase = 85 C. (3) Tcase = 85 C. Fig 21. Output power at 1 dB gain compression as a function of frequency 014aab042 0 2.445 2.465 2.485 f (GHz) Fig 22.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier GND GND VCC GND GND GND J3 C7 R1 C6 J1 J2 MSL4 MSL3 C5 MSL5 L2 MSL1 C1 MSL6 MSL2 C2 L1 J I HGF EDCBA C4 MSL7 C3 1 2 3 4 5 6 7 8 9 10 12 11 13 RF in RF out 014aab044 See Table 14 for a list of components. Fig 25. 5 V application reference board; 2405 MHz to 2485 MHz BGA7024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Table 14. 5 V application list of components; 2405 MHz to 2485 MHz See Figure 20 and Figure 25 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 m. Component Description Value Function Remarks C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D C2 capacitor 1.5 pF input match Murata GRM1885C1H1R5CZ01D C3 capacitor 1.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 12.5 PCB stack through via 35 μm (1 oz.) copper + 0.3 μm gold plating RF & analog routing RO4003C, 0.51 mm (20 mil) 35 μm (1 oz.) copper RF & analog ground (1) 0.2 mm (8 mil) 35 μm (1 oz.) copper analog routing FR4, 0.15 mm (6 mil) 35 μm (1 oz.) copper RF & analog ground 014aab045 (1) Pre-impregnated. RO4003C dielectric constant r = 3.38. Fig 26.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 13.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 14. Abbreviations Table 15.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
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BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 18. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 12.5 13 14 15 16 16.1 16.2 16.3 16.4 17 18 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . .