Datasheet

BLF178P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 16 February 2012 8 of 13
NXP Semiconductors
BLF178P
Power LDMOS transistor
7.3 Test circuit
[1] American Technical Ceramics type 800B or capacitor of same quality.
Printed-Circuit Board (PCB): RF 35; 
r
= 3.5; thickness = 0.76 mm; thickness copper plating = 35 m.
See Table 9
for a list of components.
Fig 10. Component layout for class-AB production test circuit
aaa-002248
T1
T2
BLF178P OUTPUT REV1BLF178P INTPUT REV1
23 mm
C16
C14L5
C12
C18
C4C3
C15R4
R3
C7
+Vgs
+Vgs
C5
C6
C8
R1
R2
C11
C13
+Vds
C10 +Vds
C19
C20
C21
C22
L7
L8
C17
L3
L4
L1
C1
C2
L2
L6
Table 9. List of components
For test circuit see Figure 10
.
Component Description Value Remarks
C1, C2, C5, C6, C14,
C15, C21, C22
multilayer ceramic chip capacitor 1 nF
[1]
C3 multilayer ceramic chip capacitor 82 pF
[1]
C4 multilayer ceramic chip capacitor 240 pF
[1]
C7, C8 multilayer ceramic chip capacitor 4.7 F; 50 V
C10, C11 electrolytic capacitor 1000 F; 63 V
C12, C13 multilayer ceramic chip capacitor 4.7 F; 100 V
C16, C17 multilayer ceramic chip capacitor 120 pF
[1]
C18 multilayer ceramic chip capacitor 82 pF
[1]
C19 multilayer ceramic chip capacitor 110 pF
[1]
C20 multilayer ceramic chip capacitor 56 pF
[1]
L1, L2, L3, L4 1.5 turn 0.8 mm copper wire D = 3 mm;
length=2mm
L5, L6 5 turn 0.8 mm copper wire D = 3 mm;
length = 4.5 mm
L7, L8 2.5 turn 0.8 mm copper wire D = 3 mm;
length=3mm
R1, R2 SMD resistor 100  Philips 1206
R3, R4 SMD resistor 9.1  Philips 1206
T1 semi rigid coax 25 ; 160 mm UT-090C-25
T2 semi rigid coax 25 ; 160 mm UT-141C-25