DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D088 BSV52 NPN switching transistor Product data sheet Supersedes data of 1999 Apr 15 2004 Jan 14
NXP Semiconductors Product data sheet NPN switching transistor BSV52 FEATURES PINNING • Low current (max. 100 mA) PIN • Low voltage (max. 12 V). APPLICATIONS DESCRIPTION 1 base 2 emitter 3 collector • High speed saturated switching applications, especially in portable equipment. handbook, halfpage DESCRIPTION 3 3 NPN switching transistor in a SOT23 plastic package. 1 MARKING MARKING CODE(1) TYPE NUMBER BSV52 1 B2* 2 2 Top view MAM255 Note 1. * = p : Made in Hong Kong.
NXP Semiconductors Product data sheet NPN switching transistor BSV52 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient VALUE UNIT 500 K/W note 1 Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER collector cut-off current CONDITIONS MIN. TYP. MAX.
NXP Semiconductors Product data sheet NPN switching transistor BSV52 VBB handbook, full pagewidth RB oscilloscope VCC RC Vo (probe) 450 Ω (probe) 450 Ω R2 Vi DUT R1 MLB826 Vi = 0.5 V to 4.2 V; T = 500 µs; tp = 10 µs; tr = ts ≤ 3 ns. R1 = 56 Ω; R2 = 1 kΩ; RB = 1 kΩ; RC = 270 Ω. VBB = 0.2 V; VCC = 2.7 V. Oscilloscope: input impedance Zi = 50 Ω. Fig.2 Test circuit for switching times.
NXP Semiconductors Product data sheet NPN switching transistor BSV52 PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.
NXP Semiconductors Product data sheet NPN switching transistor BSV52 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.