Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsFETsBUK9606-55A,118, MOSFET

BUK9506-55A; BUK9606-55A;

BUK9E06-55A

TrenchMOS™ logic level FET

Rev. 03 — 23 July 2001 Product data

1. Description

N-channel enhancement mode ﬁeld-effect power transistor in a plastic package using

TrenchMOS™ technology, featuring very low on-state resistance.

Product availability:

BUK9506-55A in SOT78 (TO-220AB); BUK9606-55A in SOT404 (D

-PAK);

BUK9E06-55A in SOT226 (I

-PAK).

2. Features

■ TrenchMOS™ technology

■ Q101 compliant

■ 175 °C rated

■ Logic level compatible.

3. Applications

■ Automotive and general purpose power switching:

◆ 12 V and 24 V loads

◆ Motors, lamps and solenoids.

4. Pinning information

Table 1: Pinning - SOT78, SOT404, SOT226 simpliﬁed outline and symbol

Pin Description Simpliﬁed outline Symbol

1 gate (g)

SOT78 (TO-220AB) SOT404 (D

-PAK)

SOT226 (I

-PAK)

2 drain (d)

3 source (s)

mb mounting base,

connected to

drain (d)

MBK106

MBK116

MBK112

123

MBB076

Summary of content (16 pages)

PAGE 1
BUK9506-55A; BUK9606-55A; BUK9E06-55A TrenchMOS™ logic level FET Rev. 03 — 23 July 2001 Product data 1. Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology, featuring very low on-state resistance. Product availability: BUK9506-55A in SOT78 (TO-220AB); BUK9606-55A in SOT404 (D2-PAK); BUK9E06-55A in SOT226 (I2-PAK). 2. Features ■ ■ ■ ■ TrenchMOS™ technology Q101 compliant 175 °C rated Logic level compatible. 3.
PAGE 2
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 5. Quick reference data Table 2: Quick reference data Symbol Parameter VDS Conditions drain-source voltage (DC) ID drain current (DC) Tmb = 25 °C; VGS = 5 V Ptot total power dissipation Tmb = 25 °C Tj junction temperature RDSon drain-source on-state resistance Typ Max Unit − 55 V − 154 A − 300 W − 175 °C Tj = 25 °C; VGS = 5 V; ID = 25 A 5.3 6.3 Tj = 25 °C; VGS = 4.5 V; ID = 25 A 5.5 6.
PAGE 3
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 03na19 120 Pder 03ne93 ID 180 (A) 160 (%) 100 140 80 120 100 60 80 40 60 Capped at 75A due to package 40 20 20 0 0 0 25 50 75 100 125 150 175 25 200 50 75 100 125 150 175 200 Tj (ºC) Tmb (oC) VGS ≥ 4.5 V P tot P der = ---------------------- × 100% P ° ID I der = ------------------- × 100% I ° tot ( 25 C ) D ( 25 C ) Fig 1. Normalized total power dissipation as a function of mounting base temperature. Fig 2.
PAGE 4
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 7. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Value Unit Rth(j-a) thermal resistance from junction to ambient vertical in still air; SOT78 and SOT226 packages 60 K/W mounted on printed circuit board; minimum footprint; SOT404 package 50 K/W Figure 4 0.5 K/W thermal resistance from junction to mounting base Rth(j-mb) 7.1 Transient thermal impedance 03nf03 1 Zth(j-mb) (K/W) δ = 0.
PAGE 5
Philips Semiconductors BUK9506-55A; BUK9606-55A; BUK9E06-55A 8. Characteristics Table 5: Characteristics Tj = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Tj = 25 °C 55 − − V Tj = −55 °C 50 − − V Tj = 25 °C 1 1.5 2 V Tj = 175 °C 0.5 − − V Tj = −55 °C − − 2.3 V Tj = 25 °C − 0.05 10 µA Tj = 175 °C − − 500 µA − 2 100 nA Tj = 25 °C − 5.3 6.3 mΩ Tj = 175 °C − − 13.2 mΩ VGS = 4.5 V; ID = 25 A − − 6.
PAGE 6
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors Table 5: Characteristics…continued Tj = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Source-drain diode VSD source-drain (diode forward) voltage IS = 30 A; VGS = 0 V; Figure 15 − 0.85 1.
PAGE 7
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 03aa33 2.5 (V) 03aa36 10-1 ID (A) 10-2 VGS(th) max 2 typ 10-3 1.5 min min 1 10-5 0 10-6 0 max 10-4 0.5 -60 typ 60 120 o 180 0 0.5 1 1.5 2 2.5 3 VGS (V) Tj ( C) Tj = 25 °C; VDS = VGS ID = 1 mA; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature. Fig 10. Sub-threshold drain current as a function of gate-source voltage.
PAGE 8
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 03ne97 100 ID (A) 03ne95 5 VGS (V) 80 4 VDD = 14 V 60 3 40 2 20 VDD = 44 V 1 Tj = 175 oC Tj = 25 oC 0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VGS (V) 0 20 40 60 80 100 120 QG (nC) Tj = 25 °C; ID = 25 A VDS = 25 V Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values. Fig 14. Gate-source voltage as a function of turn-on gate charge; typical values.
PAGE 9
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 9. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB E SOT78 A A1 p q mounting base D1 D L2 L1(1) Q b1 L 1 2 3 b c e e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 c D D1 E e L L1(1) L2 max. p q Q mm 4.5 4.1 1.39 1.27 0.9 0.7 1.3 1.0 0.7 0.4 15.8 15.2 6.4 5.9 10.3 9.7 2.54 15.0 13.5 3.30 2.79 3.0 3.8 3.6 3.0 2.7 2.
PAGE 10
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors Plastic single-ended surface mounted package (Philips version of D2-PAK); 3 leads (one lead cropped) SOT404 A A1 E mounting base D1 D HD 2 Lp 1 3 c b e e Q 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D max. D1 E e Lp HD Q mm 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 11 1.60 1.20 10.30 9.70 2.54 2.90 2.10 15.80 14.80 2.60 2.
PAGE 11
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors Plastic single-ended package; low-profile 3 lead TO-220AB SOT226 A A1 E D1 mounting base D L1 L2 Q b1 L 1 2 3 b e c e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) UNIT A A1 b b1 c D D1 E e L L1 L2 max Q mm 4.5 4.1 1.40 1.27 0.9 0.7 1.3 1.0 0.7 0.4 9.65 8.65 1.5 1.1 10.3 9.7 2.54 15.0 13.5 3.30 2.79 3.0 2.6 2.2 Note 1. Terminals in this zone are not tinned.
PAGE 12
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 10. Soldering 10.85 10.60 10.50 handbook, full pagewidth 1.50 7.50 7.40 1.70 2.25 2.15 8.15 8.275 8.35 1.50 4.60 0.30 4.85 5.40 7.95 8.075 3.00 0.20 1.20 1.30 1.55 solder lands solder resist 5.08 MSD057 occupied area solder paste Dimensions in mm. Fig 19. Reflow soldering footprint for SOT404. © Philips Electronics N.V. 2001. All rights reserved. 9397 750 08416 Product data Rev.
PAGE 13
Philips Semiconductors BUK9506-55A; BUK9606-55A; BUK9E06-55A 11. Revision history Table 6: Revision history Rev Date CPCN Description 03 20010723 - Product data; third version. Data sheet updated to Data Builder Two format, with the addition of SOT226 part. 02 19991202 - Product Specification; second version 01 19981011 - Product Specification; initial version © Philips Electronics N.V. 2001. All rights reserved. 9397 750 08416 Product data Rev.
PAGE 14
BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors 12. Data sheet status Data sheet status [1] Product status [2] Definition Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date.
PAGE 15
Philips Semiconductors BUK9506-55A; BUK9606-55A; BUK9E06-55A Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax.
PAGE 16
Philips Semiconductors BUK9506-55A; BUK9606-55A; BUK9E06-55A Contents 1 2 3 4 5 6 7 7.1 8 9 10 11 12 13 14 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . .