Datasheet

2004 Mar 26 3
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX884 series
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
THERMAL CHARACTERISTICS
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
BZX884-B2V4
to
BZX884-B75
Leadless ultra small plastic package;2 terminals; body 1.0 x
0.6 x 0.5 mm
SOD882
BZX884-C2V4
to
BZX884-C75
Leadless ultra small plastic package;2 terminals; body 1.0 x
0.6 x 0.5 mm
SOD882
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
F
continuous forward current 200 mA
I
ZSM
non-repetitive peak reverse
current
t
p
= 100 μs; square wave;
T
amb
= 25 °C; prior to surge
see Table s 1 and
2
P
tot
total power dissipation T
amb
= 25 °C; note 1 250 mW
T
stg
storage temperature 65 +150 °C
T
j
junction temperature 150 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient note 1 500 K/W