Datasheet

Product data sheet Rev. 02 — 15 September 2005 16 of 18

Philips Semiconductors

CBT3244A

Octal bus switch with quad output enables

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

14. Abbreviations

15. Revision history

Table 10: Abbreviations

Acronym Description

CDM Charged Device Model

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

PRR Pulse Rate Repetition

TTL Transistor-Transistor Logic

Table 11: Revision history

Document ID Release date Data sheet status Change notice Doc. number Supersedes

CBT3244_2 20050915 Product data sheet - 9397 750 13362 CBT3244A_1

Modiﬁcations:

• The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors.

• added DHVQFN20 package option (affects Section 2 “Features”, Section 3 “Ordering

information”, Section 5 “Pinning information”, and Section 12 “Package outline”

• Section 2 “Features” on page 1, 6th bullet: changed from ‘exceeds 1000 V HBM ...’ to ‘exceeds

2000 V HBM ...’

• added Section 14 “Abbreviations” on page 16

CBT3244A_1 20040526 Product data sheet - 9397 750 13281 -