Datasheet

NXP Semiconductors
GTL2002
2-bit bidirectional low voltage translator
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 19 August 2013
Document identifier: GTL2002
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
21. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 4
7.1 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4
8 Application design-in information . . . . . . . . . . 5
8.1 Bidirectional translation . . . . . . . . . . . . . . . . . . 5
8.2 Unidirectional down translation. . . . . . . . . . . . . 6
8.3 Unidirectional up translation . . . . . . . . . . . . . . . 6
8.4 Sizing pull-up resistor . . . . . . . . . . . . . . . . . . . . 7
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Recommended operating conditions. . . . . . . . 8
11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
12 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12.1 Dynamic characteristics for translator-type
application . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.2 Dynamic characteristics for CBT-type
application . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 12
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
15 Soldering of SMD packages . . . . . . . . . . . . . . 17
15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 17
15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 17
15.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 17
15.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 18
16 Soldering: PCB footprints. . . . . . . . . . . . . . . . 19
17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23
18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
19.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
20 Contact information. . . . . . . . . . . . . . . . . . . . . 26
21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27