Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLogic ICsLogic IC - Buffer, driver TSSOP 14

1. General description

The GTL2034 is a 4-bit GTL−/GTL/GTL+ bus buffer.

The GTL2034 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used

in higher voltage open-drain output applications.

2. Features

■ Operates as a 4-bit GTL−/GTL/GTL+ to GTL−/GTL/GTL+ bus buffer

■ 3.0 V to 3.6 V operation

■ GTL input and output 3.6 V tolerant

■ V

ref

adjustable from 0.5 V to V

■ Partial power-down permitted

■ ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115, and 1000 V CDM per JESD22-CC101

■ Latch-up protection exceeds 500 mA per JESD78

■ Package offered: TSSOP14

3. Quick reference data

GTL2034

4-bit GTL to GTL buffer

Rev. 01 — 11 November 2005 Product data sheet

Table 1: Quick reference data

amb

=25

Symbol Parameter Conditions Min Typ Max Unit

PLH

LOW-to-HIGH propagation delay GTL; BIn to BOn;

= 50 pF; V

= 3.3 V

- 3.1 8 ns

PHL

HIGH-to-LOW propagation delay - 4.1 10 ns

input capacitance GTL; outputs disabled;

I/O

= 0 V or 3.0 V

- 4.5 - pF

Summary of content (13 pages)

PAGE 1
GTL2034 4-bit GTL to GTL buffer Rev. 01 — 11 November 2005 Product data sheet 1. General description The GTL2034 is a 4-bit GTL−/GTL/GTL+ bus buffer. The GTL2034 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used in higher voltage open-drain output applications. 2. Features ■ ■ ■ ■ ■ ■ Operates as a 4-bit GTL−/GTL/GTL+ to GTL−/GTL/GTL+ bus buffer 3.0 V to 3.6 V operation GTL input and output 3.6 V tolerant Vref adjustable from 0.
PAGE 2
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 4. Ordering information Table 2: Ordering information Type number GTL2034PW Package Name Description Version TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 4.1 Ordering options Table 3: Ordering options Type number Topside mark Temperature range GTL2034PW GTL2034 Tamb = −40 °C to +85 °C 5. Functional diagram GTL2034 BI0 BO0 BI1 BO1 BI2 BO2 BI3 BO3 VREF 002aab148 Fig 1.
PAGE 3
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 6. Pinning information 6.1 Pinning n.c. 1 BO0 2 14 VCC 13 BI0 12 BI1 BO1 3 VREF 4 BO2 5 10 BI2 BO3 6 9 BI3 GND 7 8 GND GTL2034PW 11 GND 002aab147 Fig 2. Pin configuration for TSSOP14 6.2 Pin description Table 4: Pin description Symbol Pin Description n.c.
PAGE 4
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 8. Limiting values Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current Conditions Min Max Unit −0.5 +4.6 V VI < 0 V - −50 mA +4.6 V VI input voltage B port −0.5 [2] IOK output clamping current VO < 0 V - −50 mA −0.5 [2] +4.
PAGE 5
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 10. Static characteristics Table 8: Static characteristics Recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = −40 °C to +85 °C Symbol Parameter Conditions [2] Min Typ [1] Max Unit - 0.2 0.4 V VOL LOW-state output voltage B port; VCC = 3.0 V; IOL = 40 mA II input current B port; VCC = 3.6 V; VI = VTT or GND - - ±1 µA ILO output leakage current B port; VCC = 3.
PAGE 6
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 10.1 Performance curves 002aab144 1200 Vth+ and Vth− (mV) 1000 Vth+ Vth− Vref 800 Vth+ Vth− Vref 800 600 400 0.5 002aab145 1200 Vth+ and Vth− (mV) 1000 600 0.6 0.7 0.9 0.8 400 0.5 1.0 Vref (V) a. VCC = 3.0 V; Tamb = −40 °C 0.6 0.7 0.8 0.9 1.0 Vref (V) b. VCC = 3.3 V; Tamb = 25 °C 002aab146 1200 Vth+ and Vth− (mV) 1000 Vth+ Vth− Vref 800 600 400 0.5 0.6 0.7 0.8 0.9 1.0 Vref (V) c. VCC = 3.6 V; Tamb = 85 °C Fig 3.
PAGE 7
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 11. Dynamic characteristics Table 9: Dynamic characteristics VCC = 3.3 V ± 0.3 V Symbol Parameter Conditions Min Typ [1] Max Unit BIn to BOn; see Figure 4 - 2.8 8 ns - 5.2 10 ns BIn to BOn; see Figure 4 - 3.1 8 ns - 4.1 10 ns BIn to BOn; see Figure 4 - 3.3 8 ns - 3.6 10 ns GTL−; Vref = 0.6 V; VTT = 0.9 V tPLH LOW-to-HIGH propagation delay tPHL HIGH-to-LOW propagation delay GTL; Vref = 0.8 V; VTT = 1.
PAGE 8
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 13. Package outline TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.
PAGE 9
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages.
PAGE 10
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
PAGE 11
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
PAGE 12
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 17. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification.
PAGE 13
GTL2034 Philips Semiconductors 4-bit GTL to GTL buffer 22. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 8 9 10 10.1 11 11.1 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . .