Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLinear ICsIP4041CX25/LF/P,13

1. Product profile

1.1 General description

The IP4041CX25 is a 10-channel RC low-pass filter array which is designed to provide

filtering of undesired RF signals. In addition, the IP4041CX25 incorporates diodes to

provide protection to downstream components from ElectroStatic Discharge (ESD)

voltages as high as ±20

kV contact according the IEC 61000-4-2 standard, far exceeding

level

The IP4041CX25 is fabricated using monolithic silicon technology and integrates

resistors and 20 diodes in a single Wafer-Level Chip-Scale Package (WLCSP).

These

features make the IP4041CX25 ideal for use in applications requiring the utmost in

miniaturization such as mobile phone handsets, cordless telephones and personal digital

devices.

1.2 Features and benefits

 Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)

 10-channel integrated π-type RC filter network

 200 Ω series resistance; 50 pF (typical) channel capacitance

 Integrated ESD protection withstanding ±20 kV contact discharge, far exceeding

IEC

61000-4-2 level 4

 WLCSP with 0.5 mm pitch

1.3 Applications

Reduce ElectroMagnetic Interference (EMI) and Radio Frequency Interference (RFI) and

provide downstream ESD protection for:

 Cellular and Personal Communication System (PCS) mobile handsets

 Cordless telephones

 Other appliances with low frequency signals (e.g. keypads)

 Wireless data (WAN/LAN) systems and PDAs

IP4041CX25

10-channel integrated filter network with ESD input protection

to IEC

61000-4-2 level 4

Rev. 01 — 12 February 2010 Product data sheet

Summary of content (12 pages)

PAGE 1
IP4041CX25 10-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4 Rev. 01 — 12 February 2010 Product data sheet 1. Product profile 1.1 General description The IP4041CX25 is a 10-channel RC low-pass filter array which is designed to provide filtering of undesired RF signals.
PAGE 2
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 2. Pinning information 2.1 Pinning bump A1 index area 1 2 3 4 5 A B C D E 008aaa193 transparent top view, solder balls facing down Fig 1. Pin configuration IP4041CX25 2.2 Pin description Table 1.
PAGE 3
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 4. Functional diagram A1, A2, A3, A4, A5, B1, B2, B3, B4, B5 Rs(ch) D1, D2, D3, D4, D5, E1, E2, E3, E4, E5 C1, C2, C3, C4, C5 008aaa195 Fig 2. Schematic diagram IP4041CX25 5. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
PAGE 4
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 6. Characteristics Table 4. Channel characteristics Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 180 200 220 Ω Rs(ch) channel series resistance Cch channel capacitance Vbias(DC) = 0 V; f = 1 MHz - 50 - pF VBR breakdown voltage Itest = 1 mA 6 - 15 V ILR reverse leakage current per channel; VI = 3.0 V - - 25 nA Table 5.
PAGE 5
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 7. Application information 7.1 Insertion loss The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for evaluation of the IP4041CX25 is shown in Figure 3. The insertion loss of all channels for frequencies up to 6 GHz is displayed in Figure 4. IN 50 Ω DUT OUT 50 Ω on-device measurement Vgen 008aaa203 Fig 3.
PAGE 6
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 7.2 Crosstalk The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of the IP4041CX25 is shown in Figure 5.
PAGE 7
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 8. Package outline WLCSP25: wafer level chip-size package; 25 bumps (5 x 5) D bump A1 index area A2 E A A1 detail X e1 e b E e D e1 C B A European projection 1 2 3 4 X 5 wlcsp25_5x5_po Fig 7. Table 6. Package outline IP4041CX25 (WLCSP25) Dimensions for Figure 7 Symbol Min Typ Max Unit A 0.60 0.65 0.70 mm A1 0.22 0.24 0.26 mm A2 0.38 0.41 0.44 mm b 0.27 0.32 0.
PAGE 8
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 9. Design and assembly recommendations 9.1 PCB design guidelines For optimum performance it is recommended to use a Non-Solder Mask PCB Design (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance.
PAGE 9
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection Table 9.
PAGE 10
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
PAGE 11
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications
PAGE 12
IP4041CX25 NXP Semiconductors 10-channel integrated filter network with ESD input protection 14. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 7.1 7.2 8 9 9.1 9.2 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . .