Datasheet

IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 14 December 2012 13 of 18
NXP Semiconductors
IP4085/4385/4386/4387/CX4
Integrated high-performance ESD protection diodes
The device is capable of withstanding at least three reflows of this profile.
Fig 18. Pb-free solder reflow profile
Table 10. Reflow soldering process characteristics
Symbol Parameter Conditions Min Typ Max Unit
T
reflow(peak)
peak reflow temperature 230 - 260 C
t
1
time 1 soak time 60 - 180 s
t
2
time 2 time during T  250 C--30s
t
3
time 3 time during T  230 C10- 50s
t
4
time 4 time during T > 217 C 30 - 150 s
t
5
time 5 - - 540 s
dT/dt rate of change of
temperature
cooling rate - - 6 C/s
pre-heat 2.5 - 4.0 C/s
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T
reflow(peak)
250
230
217
T
(°C)
cooling rate
preheat
t
1
t
5
t
4
t
3
t
2
t (s)