Datasheet

IP4085_4385_4386_4387_CX4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 14 December 2012 2 of 18
NXP Semiconductors
IP4085/4385/4386/4387/CX4
Integrated high-performance ESD protection diodes
2. Pinning information
3. Ordering information
[1] Size: 0.91  0.91  0.65 mm
[2] Size: 0.76  0.76  0.61 mm
Table 1. Pinning
Pin Description Simplified outline Graphic symbol
A1 and A2 cathode
B1 and B2 anode
008aaa236
transparent top view,
solder balls facing down
B
A
21
bump A1
index area
006aad220
A1
B1
A2
B2
Table 2. Ordering information
Type number Package
Name Description Version
IP4085CX4/LF/P WLCSP4 wafer level chip-size package: 4 bumps (2  2)
[1]
IP4085CX4/LF/P
IP4385CX4/LF wafer level chip-size package: 4 bumps (2  2)
[2]
IP4385CX4/LF
IP4386CX4/P IP4386CX4/P
IP4387CX4/P IP4387CX4/P