User's Manual
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Overview
- 5. Marking
- 6. Block diagram
- 7. Pinning information
- 8. Functional description
- 9. Limiting values
- 10. Recommended operating conditions
- 11. Characteristics
- 12. Federal Communication Commission Statement
- 13. Industry Canada statement
- 14. Footprint information for reflow soldering
- 15. Package outline
- 16. Abbreviations
- 17. References
- 18. Legal information
- 19. Tables
- 20. Figures
- 21. Contents
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 19 of 24
NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
15. Package outline
Fig 6. Package outline JN5169-001-M00-2
Fig 7. Package outline JN5169-001-M03-2
30
16
2.54
3.30
2.54
1.27
aaa-022826
Dimensions in mm
Thickness: 3.5 mm
aaa-022827
Dimensions in mm
Thickness: 3.5 mm
21
16
2.54
3.30
2.54
1.27
2.53
10.85