User's Manual
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Overview
- 5. Marking
- 6. Block diagram
- 7. Pinning information
- 8. Functional description
- 9. Limiting values
- 10. Recommended operating conditions
- 11. Characteristics
- 12. Federal Communication Commission Statement
- 13. Industry Canada statement
- 14. Footprint information for reflow soldering
- 15. Package outline
- 16. Abbreviations
- 17. References
- 18. Legal information
- 19. Tables
- 20. Figures
- 21. Contents
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
User manual Rev. 1.0 — 15 June 2016 23 of 24
NXP Semiconductors
UM11016
ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules
19. Tables
Table 1. Variants and identifications information . . . . . . .3
Table 2. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 3. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 4. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .9
Table 5. Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Table 6. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .13
Table 7. Operating conditions . . . . . . . . . . . . . . . . . . . .14
Table 8. Active processing . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 10. Deep sleep mode . . . . . . . . . . . . . . . . . . . . . . 15
Table 11. RF port characteristics . . . . . . . . . . . . . . . . . . 15
Table 12. Radio transceiver characteristics: +25 °C . . . . 15
Table 13. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 21
20. Figures
Fig 1. JN5169-001-M00-2 and JN5169-001-M03-2
packages marking (top view) . . . . . . . . . . . . . . . . .6
Fig 2. JN5169-001-M06-2 package marking (top view). .7
Fig 3. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Fig 4. Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .9
Fig 5. Module PCB footprint. . . . . . . . . . . . . . . . . . . . . .18
Fig 6. Package outline JN5169-001-M00-2 . . . . . . . . . .19
Fig 7. Package outline JN5169-001-M03-2 . . . . . . . . . .19
Fig 8. Package outline JN5169-001-M06-2 . . . . . . . . . .20