Datasheet

KTY81_SER_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 25 April 2008 12 of 15
NXP Semiconductors
KTY81 series
Silicon temperature sensors
8. Packing information
Note: Types in bulk packaging have a lead-to-lead distance of 2.54 mm (see Figure 4).
The lead-to-lead distance of types packaged on reel have a lead-to-lead distance of
5.08 mm, spread leads (see Figure 5).
Fig 5. Configuration of bandolier: spread leads
mbh795
(p)
P
A
L
H
1
H
0
F
1
F
2
D
0
P
0
P
2
H
2
A
1
F
W
2
W
0
W
1
W
t
t
1
∆ h ∆ h
T