Datasheet

KTY81_SER_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 25 April 2008 13 of 15
NXP Semiconductors
KTY81 series
Silicon temperature sensors
9. Revision history
Table 13. Tape specification
Symbol Dimension Specifications Remarks
Min Typ Max Tolerance Unit
A
1
body width 4.4 - 4.8 - mm
A body height 5 - 5.2 - mm
T body thickness 3.6 - 4.2 - mm
P pitch of component - 12.7 - ±1mm
P
0
feed hole pitch - 12.7 - ±0.3 mm
cumulative pitch error −1 - +1 - mm measured over 20 devices
P
2
feed hole center to component
center
- 6.35 - ±0.4 mm to be measured at bottom of
clinch
F lead-to-lead distance - 5.08 - +0.6/−0.2 mm spread leads
∆h component alignment - 0 1 - mm at top of body
W tape width - 18 - ±0.5 mm
W
0
hold-down tape width - 6 - ±0.2 mm
W
1
hole position - 9 - +0.7/−0.5 mm
W
2
hold-down tape position - 0.5 - ±0.2 mm
H
0
lead wire clinch height - 16.5 - ±0.5 mm
H
1
component height - - 23.25 - mm
L length of snipped leads - - 11 - mm
D
0
feed hole diameter - 4 - ±0.2 mm
t total tape thickness - - 1.2 - mm t
1
= 0.3 mm to 0.6 mm
F
1
, F
2
lead to snipped lead distance - 2.54 - +0.4/−0.2 mm spread leads
H
2
clinch height - 2.5 - +0.5/0 mm
(p) pull-out force 6 - - - N
Table 14. Revision history
Document ID Release date Data sheet status Change notice Supersedes
KTY81_SER_5 20080425 Product data sheet - KTY81-2SERIES_4
KTY81-1SERIES_3
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
KTY81-2SERIES_4 20000825 Product specification - -
KTY81-1SERIES_3 20000825 Product specification - -