Datasheet

LM75B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2015. All rights reserved.
Product data sheet Rev. 6.1 — 6 February 2015 3 of 37
NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
4. Ordering information
[1] LM75BGD cannot be production cold temperature tested because of manufacturing process constraints. Although no LM75BGD
complaints have been noted, NXP recommends consideration/use of the LM75BTP instead of the LM75BGD in operating environments
of less than 0 C.
4.1 Ordering options
Table 1. Ordering information
Type
number
Topside
mark
Package
Name Description Version
LM75BD LM75BD SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
LM75BDP LM75B TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
LM75BGD
[1]
75B XSON8U plastic extremely thin small outline package; no leads; 8 terminals;
UTLP based; body 3  2  0.5 mm
SOT996-2
LM75BTP M75 HWSON8 plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals, 2  3  0.8 mm
SOT1069-2
Table 2. Ordering options
Type number Orderable
part number
Package Packing method Minimum
order
quantity
Temperature
LM75BD LM75BD,112 SO8 Standard marking * IC’s tube -
DSC bulk pack
2000 T
amb
= 55 C to +125 C
LM75BD,118 SO8 Reel 13” Q1/T1
*Standard mark SMD
2500 T
amb
= 55 C to +125 C
LM75BDP LM75BDP,118 TSSOP8 Reel 13” Q1/T1
*Standard mark SMD
2500 T
amb
= 55 C to +125 C
LM75BGD LM75BGD,125 XSON8U Reel 7” Q3/T4 *Standard mark 3000 T
amb
= 55 C to +125 C
LM75BTP LM75BTP,147 HWSON8 Reel 7” Q2/T3 *Standard mark 4000 T
amb
= 55 C to +125 C