Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 110 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Fig 61. Package outline SOT616-3 (HVQFN24)
0.51 0.2
A
1
E
h
b
UNIT
ye
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.1
3.9
D
h
2.75
2.45
y
1
4.1
3.9
2.75
2.45
e
1
2.5
e
2
2.5
0.30
0.18
c
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT616-3 MO-220
04-11-19
05-03-10
- - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT616-3
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
712
24 19
18
13
6
1
X
D
E
C
B
A
e
2
terminal 1
index area
terminal 1
index area
AC
C
B
v
M
w
M
1/2 e
1/2 e
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)