Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 116 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Fig 67. Reflow soldering of the HVQFN33 package (5x5)
Footprint information for reflow soldering of HVQFN33 package
occupied area
solder paste
solder land
Dimensions in mm
P
0.5
002aag766
Issue date
11-11-15
11-11-20
Ax Ay Bx C D
5.95 5.95 4.25 0.85
By
4.25 0.27
Gx
5.25
Gy
5.25
Hy
6.2
Hx
6.2
SLx SLy nSPx nSPy
3.75 3.75 3 3
0.30
0.60
detail X
C
SLy
D
SLx
Bx
Ay
P
nSPy
nSPx
see detail X
Gx
Hx
GyHy
By
Ax