Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 114 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Fig 65. Reflow soldering of the TSSOP28 package
DIMENSIONS in mm
Ay By D1 D2 Gy HyP1 C Gx
sot361-1_fr
Hx
SOT361-1
solder land
occupied area
Footprint information for reflow soldering of TSSOP28 package
AyByGy
C
Hy
Hx
Gx
P1
Generic footprint pattern
Refer to the package outline drawing for actual layout
P2
(0.125) (0.125)
D1
D2 (4x)
P2
7.200 4.500 1.350 0.400 0.600 9.500 5.300 7.45011.8000.650 0.750