Datasheet

LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 9.2 — 26 March 2014 4 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
LPC1112FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112FHN24/202 HVQFN24 HVQFN24: plastic thermal enhanced very thin quad flat package; no
leads; 24 terminals; body 4 x 4 x 0.85 mm
SOT616-3
LPC1112FHI33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1112FHI33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1112FHI33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1112JHI33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1112FHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112JHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.
85 mm
n/a
L
PC1113JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/301 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/302 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/303 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113JHN33/303 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/301 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/302 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
Table 1. Ordering information
…continued
Type number Package
Name Description Version