Datasheet

LPC1759_58_56_54_52_51 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 8.5 — 24 June 2014 73 of 80
NXP Semiconductors
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
17. Soldering
Fig 39. Reflow soldering for the LQFP80 package
SOT315-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP80 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
15.300 15.300 12.300 12.300
P1
0.500
P2
0.560 0.280
C
1.500 0.400 12.500 12.500 15.550 15.550
sot315-1_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout