Datasheet

LPC1850_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 6.4 — 18 August 2014 138 of 150
NXP Semiconductors
LPC1850/30/20/10
32-bit ARM Cortex-M3 microcontroller
15. Soldering
Fig 52. Reflow soldering of the LBGA256 package
DIMENSIONS in mm
PSLSPSRHxHy
Hx
Hy
SOT740-2
solder land plus solder paste
occupied area
Footprint information for reflow soldering of LBGA256 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot740-2_fr
1.00 0.450 0.450 0.600 17.500 17.500