Datasheet

LPC185X_3X_2X_1X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.1 — 6 May 2014 138 of 148
NXP Semiconductors
LPC185x/3x/2x/1x
32-bit ARM Cortex-M3 microcontroller
Fig 53. Reflow soldering for the TFBGA100 package
DIMENSIONS in mm
PSLSPSRHxHy
Hx
Hy
SOT926-1
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA100 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot926-1_fr
0.80 0.330 0.400 0.480 9.400 9.400