Datasheet

LPC185X_3X_2X_1X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.1 — 6 May 2014 139 of 148
NXP Semiconductors
LPC185x/3x/2x/1x
32-bit ARM Cortex-M3 microcontroller
Fig 54. Reflow soldering for the LQFP208 package
SOT459-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP208 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx HyP1 P2 C
sot459-1_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
31.300 31.300 28.300 28.3000.500 0.560 0.2801.500 0.400 28.500 28.500 31.550 31.550