Datasheet
LPC185X_3X_2X_1X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.1 — 6 May 2014 144 of 148
NXP Semiconductors
LPC185x/3x/2x/1x
32-bit ARM Cortex-M3 microcontroller
Modifications: • SPIFI dynamic characteristics added in Section 11.16.
• IRC accuracy corrected to 2 % for T
amb
= -40 °C to 0 °C and T
amb
= 85 °C to 105 °C.
• Pull-up and Pull-down current data (Figure 23 and Figure 24) updated with data for
T
amb
= 105 °C.
• SCT dither engine added and SCT bi-directional event enable features added. See
Section 7.15.1.
• SPIFI maximum data rate changed to 52 MB per second.
• Recommendation for V
BAT
use added: The recommended operating condition for the
battery supply is V
DD(REG)(3V3)
> V
BAT
+ 0.2 V. See Table 11, Table note 2.
• Table 14 “Band gap characteristics” added.
• Minimum value for parameter V
IL
changed to 0 V in Table 11 “Static characteristics”.
• Description of ADC pins on digital/analog input pins changed. Each input to the ADC
is connected to ADC0 and ADC1. See Table 3.
• OTP memory size changed to 64 bit.
• Use of C_CAN peripheral restricted in Section 2.
• ADC channels limited to a total of 8 channels shared between ADC0 and ADC1.
LPC1857_53 v.3.2 20120920 Preliminary data sheet - LPC1857_53 v.3.1
Position of index sector in Figure 4 “Pin configuration LQFP208 package” corrected.
LPC1857_53 v.3.1 20120904 Preliminary data sheet - LPC1857_53 v.3
Modifications:
• SSP0 boot pin functions added in Table 5 and Table 4. Pin P3_3 = SSP0_SCK, pin
P3_6 = SSP0_SSEL, pin P3_7 = SSP0_MISO, pin P3_8 = SSP0_MOSI.
• Peripheral power consumption data added in Table 12.
• BOD de-assertion levels add in Table 13.
• Minimum value for all supply voltages changed to -0.5 V n Table 7.
LPC1857_53 v.3 20120711 Preliminary data sheet - LPC1857_53 v.2
Modifications:
• Data sheet status changed to preliminary.
• AES removed. Available on parts LPC18Sxx only.
• Minimum value of V
I
for conditions “USB0 pins USB0_DP; USB0_DM; USB0_VBUS”,
“USB0 pins USB0_ID; USB0_RREF”, and “USB1 pins USB1_DP and USB1_DM”
changed to 0.3 V in Table 6.
• Dynamic characteristics of the SD/MMC controller updated in Table 29.
• Dynamic characteristics of the LCD controller updated in Table 30.
• Dynamic characteristics of the SSP controller updated in Table 22.
• Section 10.2 added.
• Table 8 “Thermal resistance value (BGA packages)” added.
• Description of pins USB1_DP and USB1_DM updated in Table 3.
• Editorial updates.
• Parameters I
IL
and I
IH
renamed to I
LL
and I
LH
in Table 9.
LPC1857_53 v.2 20120515 Objective data sheet - LPC1857_53 v.1
LPC1857_53 v.1 20111214 Objective data sheet - -
Table 42. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes