Datasheet

LPC2104_2105_2106_7 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 07 — 20 June 2008 37 of 41
NXP Semiconductors
LPC2104/2105/2106
Single-chip 32-bit microcontrollers
Fig 14. Package outline SOT619-1 (HVQFN48)
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
7.1
6.9
D
h
5.25
4.95
y
1
7.1
6.9
5.25
4.95
e
1
5.5
e
2
5.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT619-1 MO-220 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT619-1
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
13 24
48
37
36
25
12
1
X
D
E
C
B
A
e
2
01-08-08
02-10-18
terminal 1
index area
terminal 1
index area
1/2 e
1/2 e
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)