Datasheet

LPC2292_2294 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 8 June 2011 49 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
Fig 26. Package outline SOT569-2 (TFBGA144)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT569-2
SOT569-2
UNIT
mm
max
nom
min
1.20
1.05
0.95
0.40
0.35
0.30
0.50
0.45
0.40
12.1
12.0
11.9
12.1
12.0
11.9
0.8 9.6 0.15 0.1
A
DIMENSIONS (mm are the original dimensions)
TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls
0 5 10 mm
scale
A
1
A
2
0.80
0.70
0.65
b D E e e
1
9.6
e
2
v w
0.05
y y
1
0.08
C
y
C
y
1
X
A
B
C
D
E
F
H
K
G
L
J
M
N
24681012
135791113
b
e
2
e
1
e
e
AC
B
∅ v
M
C∅ w
M
ball A1
index area
B
A
ball A1
index area
D
E
detail X
A
A
2
A
1
08-01-29
08-03-14