Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 100 (14x14) 16/32-Bit 72 MHz I/O number 70

Table Of Contents

1. General description
2. Features and benefits
3. Applications
4. Ordering information
- 4.1 Ordering options
5. Block diagram
6. Pinning information
- 6.1 Pinning
- 6.2 Pin description
7. Functional description
- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
  - 7.5.1 Interrupt sources
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
  - 7.7.1 Features
- 7.8 Fast general purpose parallel I/O
  - 7.8.1 Features
- 7.9 Ethernet (LPC2362 only)
  - 7.9.1 Features
- 7.10 USB interface
  - 7.10.1 USB device controller
    - 7.10.1.1 Features
  - 7.10.2 USB host controller
    - 7.10.2.1 Features
  - 7.10.3 USB OTG controller
    - 7.10.3.1 Features
- 7.11 CAN controller and acceptance filters
  - 7.11.1 Features
- 7.12 10-bit ADC
  - 7.12.1 Features
- 7.13 10-bit DAC
  - 7.13.1 Features
- 7.14 UARTs
  - 7.14.1 Features
- 7.15 SPI serial I/O controller
  - 7.15.1 Features
- 7.16 SSP serial I/O controller
  - 7.16.1 Features
- 7.17 I2C-bus serial I/O controllers
  - 7.17.1 Features
- 7.18 I2S-bus serial I/O controllers
  - 7.18.1 Features
- 7.19 General purpose 32-bit timers/external event counters
  - 7.19.1 Features
- 7.20 Pulse width modulator
  - 7.20.1 Features
- 7.21 Watchdog timer
  - 7.21.1 Features
- 7.22 RTC and battery RAM
  - 7.22.1 Features
- 7.23 Clocking and power control
  - 7.23.1 Crystal oscillators
  - 7.23.2 PLL
  - 7.23.3 Wake-up timer
  - 7.23.4 Power control
- 7.24 System control
  - 7.24.1 Reset
  - 7.24.2 Brownout detection
  - 7.24.3 Code security (Code Read Protection - CRP)
  - 7.24.4 AHB
  - 7.24.5 External interrupt inputs
  - 7.24.6 Memory mapping control
- 7.25 Emulation and debugging
  - 7.25.1 EmbeddedICE
  - 7.25.2 Embedded trace
  - 7.25.3 RealMonitor
8. Limiting values
9. Thermal characteristics
10. Static characteristics
- 10.1 Power-down mode
- 10.2 Deep power-down mode
- 10.3 Electrical pin characteristics
11. Dynamic characteristics
- 11.1 Internal oscillators
- 11.2 I/O pins
- 11.3 USB interface
- 11.4 Flash memory
- 11.5 Timing
12. ADC electrical characteristics
13. DAC electrical characteristics
14. Application information
- 14.1 Suggested USB interface solutions
- 14.2 Crystal oscillator XTAL input and component selection
- 14.3 RTC 32 kHz oscillator component selection
- 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
- 14.5 Standard I/O pin configuration
- 14.6 Reset pin configuration
15. Package outline
16. Abbreviations
17. Revision history
18. Legal information
- 18.1 Data sheet status
- 18.2 Definitions
- 18.3 Disclaimers
- 18.4 Trademarks
19. Contact information
20. Contents

Product data sheet Rev. 5.1 — 15 October 2013 40 of 65

NXP Semiconductors

LPC2361/62

Single-chip 16-bit/32-bit MCU

10.2 Deep power-down mode

DD(3V3)

= V

i(VBAT)

= 3.3 V; T

amb

=25C.

Fig 6. Total DC-to-DC converter supply current I

DD(DCDC)pd(3V3)

at different temperatures

in Power-down mode

002aae051

200

600

400

800

temperature (°C)

−40 853510 60−15

DD(DCDC)(3V3)

= 3.3 V

DD(DCDC)(3V3)

= 3.0 V

DD(DCDC)pd(3v3)

(μA)

DD(3V3)

= V

DD(DCDC)(3V3)

= 3.3 V; T

amb

=25C.

Fig 7. I/O maximum supply current I

DD(IO)

versus temperature in Deep power-down

mode

temperature (°C)

−40 853510 60−15

002aae046

100

200

300

DD(IO)

(μA)

DD(3V3)

= 3.3 V

DD(3V3)

= 3.0 V