Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description
- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
- 7.8 Fast general purpose parallel I/O
- 7.9 Ethernet (LPC2362 only)
- 7.10 USB interface
- 7.11 CAN controller and acceptance filters
- 7.12 10-bit ADC
- 7.13 10-bit DAC
- 7.14 UARTs
- 7.15 SPI serial I/O controller
- 7.16 SSP serial I/O controller
- 7.17 I2C-bus serial I/O controllers
- 7.18 I2S-bus serial I/O controllers
- 7.19 General purpose 32-bit timers/external event counters
- 7.20 Pulse width modulator
- 7.21 Watchdog timer
- 7.22 RTC and battery RAM
- 7.23 Clocking and power control
- 7.24 System control
- 7.25 Emulation and debugging
- 8. Limiting values
- 9. Thermal characteristics
- 10. Static characteristics
- 11. Dynamic characteristics
- 12. ADC electrical characteristics
- 13. DAC electrical characteristics
- 14. Application information
- 15. Package outline
- 16. Abbreviations
- 17. Revision history
- 18. Legal information
- 19. Contact information
- 20. Contents
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 42 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
10.3 Electrical pin characteristics
Conditions: V
DD(3V3)
= 3.3 V; standard port pins.
Fig 10. Typical HIGH-level output voltage V
OH
versus HIGH-level output source current
I
OH
Conditions: V
DD(3V3)
= 3.3 V; standard port pins.
Fig 11. Typical LOW-level output current I
OL
versus LOW-level output voltage V
OL
I
OH
(mA)
0 24168
002aaf112
2.8
2.4
3.2
3.6
V
OH
(V)
2.0
T = 85 °C
25 °C
−40 °C
V
OL
(V)
0 0.60.40.2
002aaf111
5
10
15
I
OL
(mA)
0
T = 85 °C
25 °C
−40 °C