Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description
- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
- 7.8 Fast general purpose parallel I/O
- 7.9 Ethernet (LPC2362 only)
- 7.10 USB interface
- 7.11 CAN controller and acceptance filters
- 7.12 10-bit ADC
- 7.13 10-bit DAC
- 7.14 UARTs
- 7.15 SPI serial I/O controller
- 7.16 SSP serial I/O controller
- 7.17 I2C-bus serial I/O controllers
- 7.18 I2S-bus serial I/O controllers
- 7.19 General purpose 32-bit timers/external event counters
- 7.20 Pulse width modulator
- 7.21 Watchdog timer
- 7.22 RTC and battery RAM
- 7.23 Clocking and power control
- 7.24 System control
- 7.25 Emulation and debugging
- 8. Limiting values
- 9. Thermal characteristics
- 10. Static characteristics
- 11. Dynamic characteristics
- 12. ADC electrical characteristics
- 13. DAC electrical characteristics
- 14. Application information
- 15. Package outline
- 16. Abbreviations
- 17. Revision history
- 18. Legal information
- 19. Contact information
- 20. Contents
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 44 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
11.1 Internal oscillators
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
11.2 I/O pins
[1] Applies to standard I/O pins and RESET pin.
11.3 USB interface
[1] Characterized but not implemented as production test. Guaranteed by design.
Table 9. Dynamic characteristic: internal oscillators
T
amb
=
40
C to +85
C; 3.0 V
V
DD(3V3)
3.6 V.
[1]
Symbol Parameter Conditions Min Typ
[2]
Max Unit
f
osc(RC)
internal RC oscillator frequency - 3.96 4.02 4.04 MHz
f
i(RTC)
RTC input frequency - - 32.768 - kHz
Table 10. Dynamic characteristic: I/O pins
[1]
T
amb
=
40
C to +85
C; V
DD(3V3)
over specified ranges.
Symbol Parameter Conditions Min Typ Max Unit
t
r
rise time pin configured as output 3.0 - 5.0 ns
t
f
fall time pin configured as output 2.5 - 5.0 ns
Table 11. Dynamic characteristics of USB pins
C
L
= 50 pF; R
pu
= 1.5 k
on D+ to V
DD(3V3)
,unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
t
r
rise time 10 % to 90 % 8.5 - 13.8 ns
t
f
fall time 10 % to 90 % 7.7 - 13.7 ns
t
FRFM
differential rise and fall time
matching
t
r
/t
f
--109%
V
CRS
output signal crossover voltage 1.3 - 2.0 V
t
FEOPT
source SE0 interval of EOP see Figure 13 160 - 175 ns
t
FDEOP
source jitter for differential transition
to SE0 transition
see Figure 13 2-+5ns
t
JR1
receiver jitter to next transition 18.5 - +18.5 ns
t
JR2
receiver jitter for paired transitions 10 % to 90 % 9-+9ns
t
EOPR1
EOP width at receiver must reject as
EOP; see
Figure 13
[1]
40 --ns
t
EOPR2
EOP width at receiver must accept as
EOP; see
Figure 13
[1]
82 --ns
