Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 100 (14x14) 16/32-Bit 72 MHz I/O number 70

Table Of Contents

1. General description
2. Features and benefits
3. Applications
4. Ordering information
- 4.1 Ordering options
5. Block diagram
6. Pinning information
- 6.1 Pinning
- 6.2 Pin description
7. Functional description
- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
  - 7.5.1 Interrupt sources
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
  - 7.7.1 Features
- 7.8 Fast general purpose parallel I/O
  - 7.8.1 Features
- 7.9 Ethernet (LPC2362 only)
  - 7.9.1 Features
- 7.10 USB interface
  - 7.10.1 USB device controller
    - 7.10.1.1 Features
  - 7.10.2 USB host controller
    - 7.10.2.1 Features
  - 7.10.3 USB OTG controller
    - 7.10.3.1 Features
- 7.11 CAN controller and acceptance filters
  - 7.11.1 Features
- 7.12 10-bit ADC
  - 7.12.1 Features
- 7.13 10-bit DAC
  - 7.13.1 Features
- 7.14 UARTs
  - 7.14.1 Features
- 7.15 SPI serial I/O controller
  - 7.15.1 Features
- 7.16 SSP serial I/O controller
  - 7.16.1 Features
- 7.17 I2C-bus serial I/O controllers
  - 7.17.1 Features
- 7.18 I2S-bus serial I/O controllers
  - 7.18.1 Features
- 7.19 General purpose 32-bit timers/external event counters
  - 7.19.1 Features
- 7.20 Pulse width modulator
  - 7.20.1 Features
- 7.21 Watchdog timer
  - 7.21.1 Features
- 7.22 RTC and battery RAM
  - 7.22.1 Features
- 7.23 Clocking and power control
  - 7.23.1 Crystal oscillators
  - 7.23.2 PLL
  - 7.23.3 Wake-up timer
  - 7.23.4 Power control
- 7.24 System control
  - 7.24.1 Reset
  - 7.24.2 Brownout detection
  - 7.24.3 Code security (Code Read Protection - CRP)
  - 7.24.4 AHB
  - 7.24.5 External interrupt inputs
  - 7.24.6 Memory mapping control
- 7.25 Emulation and debugging
  - 7.25.1 EmbeddedICE
  - 7.25.2 Embedded trace
  - 7.25.3 RealMonitor
8. Limiting values
9. Thermal characteristics
10. Static characteristics
- 10.1 Power-down mode
- 10.2 Deep power-down mode
- 10.3 Electrical pin characteristics
11. Dynamic characteristics
- 11.1 Internal oscillators
- 11.2 I/O pins
- 11.3 USB interface
- 11.4 Flash memory
- 11.5 Timing
12. ADC electrical characteristics
13. DAC electrical characteristics
14. Application information
- 14.1 Suggested USB interface solutions
- 14.2 Crystal oscillator XTAL input and component selection
- 14.3 RTC 32 kHz oscillator component selection
- 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
- 14.5 Standard I/O pin configuration
- 14.6 Reset pin configuration
15. Package outline
16. Abbreviations
17. Revision history
18. Legal information
- 18.1 Data sheet status
- 18.2 Definitions
- 18.3 Disclaimers
- 18.4 Trademarks
19. Contact information
20. Contents

Product data sheet Rev. 5.1 — 15 October 2013 45 of 65

NXP Semiconductors

LPC2361/62

Single-chip 16-bit/32-bit MCU

11.4 Flash memory

[1] Number of program/erase cycles.

[2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.

11.5 Timing

Table 12. Dynamic characteristics of flash

amb





C to +85



C, unless otherwise specified; V

DD(3V3)

= 3.0 V to 3.6 V; all voltages are measured with respect to

ground.

Symbol Parameter Conditions Min Typ Max Unit

endu

endurance

[1]

10000 100000 - cycles

ret

retention time powered; 100 cycles

[2]

10--years

unpowered;  100 cycles 20 - - years

erase time sector or multiple

consecutive sectors

95 100 105 ms

prog

programming time

[2]

0.95 1 1.05 ms

Fig 13. Differential data-to-EOP transition skew and EOP width

002aab561

PERIOD

differential

data lines

crossover point

source EOP width: t

FEOPT

receiver EOP width: t

EOPR1

, t

EOPR2

crossover point

extended

differential data to

SE0/EOP skew

n × T

PERIOD

+ t

FDEOP