Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description
- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
- 7.8 Fast general purpose parallel I/O
- 7.9 Ethernet (LPC2362 only)
- 7.10 USB interface
- 7.11 CAN controller and acceptance filters
- 7.12 10-bit ADC
- 7.13 10-bit DAC
- 7.14 UARTs
- 7.15 SPI serial I/O controller
- 7.16 SSP serial I/O controller
- 7.17 I2C-bus serial I/O controllers
- 7.18 I2S-bus serial I/O controllers
- 7.19 General purpose 32-bit timers/external event counters
- 7.20 Pulse width modulator
- 7.21 Watchdog timer
- 7.22 RTC and battery RAM
- 7.23 Clocking and power control
- 7.24 System control
- 7.25 Emulation and debugging
- 8. Limiting values
- 9. Thermal characteristics
- 10. Static characteristics
- 11. Dynamic characteristics
- 12. ADC electrical characteristics
- 13. DAC electrical characteristics
- 14. Application information
- 15. Package outline
- 16. Abbreviations
- 17. Revision history
- 18. Legal information
- 19. Contact information
- 20. Contents
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 59 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
17. Revision history
Table 19. Revision history
Document ID Release date Data sheet status Change notice Supersedes
LPC2361_62 v.5.1 20131015 Product data sheet - LPC2361_62 v.5
Modifications:
• Table 3 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns.
• Table 8 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.
LPC2361_62 v.5 20111025 Product data sheet - LPC2361_62 v.4
Modifications:
• Table 3:
– Updated description for USB_UP_LED.
– Added Table note 7 for TCK and TDO pins.
– Added Table note 8 for TMS, TDI, TRST
, and RTCK pins.
– Added Table note 12 for RTCX1 and RTCX2 pins.
• Table 4:
– Added “non-operating” to conditions column of T
stg
.
– Updated storage temperature minimum/maximum to 65/+150.
– Updated Table note 5.
• Table 7: Changed V
hys
typical value from 0.5V
DD(3V3)
to 0.05V
DD(3V3)
.
• Table 12: Updated table.
• Section 14.2: Changed section title and updated contents.
• Section 14.4: Changed section title.
• Added:
– Section 9 “Thermal characteristics”.
– Section 10.3 “Electrical pin characteristics”.
– Section 11.1 “Internal oscillators”.
– Section 11.2 “I/O pins”.
– Section 14.3 “RTC 32 kHz oscillator component selection”
– Section 14.5 “Standard I/O pin configuration”
– Section 14.6 “Reset pin configuration”.
LPC2361_62 v.4 20100304 Product data sheet - LPC2361_62 v.3