Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 100 (14x14) 16/32-Bit 72 MHz I/O number 70

Table Of Contents

1. General description
2. Features and benefits
3. Applications
4. Ordering information
- 4.1 Ordering options
5. Block diagram
6. Pinning information
- 6.1 Pinning
- 6.2 Pin description
7. Functional description
- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
  - 7.5.1 Interrupt sources
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
  - 7.7.1 Features
- 7.8 Fast general purpose parallel I/O
  - 7.8.1 Features
- 7.9 Ethernet (LPC2362 only)
  - 7.9.1 Features
- 7.10 USB interface
  - 7.10.1 USB device controller
    - 7.10.1.1 Features
  - 7.10.2 USB host controller
    - 7.10.2.1 Features
  - 7.10.3 USB OTG controller
    - 7.10.3.1 Features
- 7.11 CAN controller and acceptance filters
  - 7.11.1 Features
- 7.12 10-bit ADC
  - 7.12.1 Features
- 7.13 10-bit DAC
  - 7.13.1 Features
- 7.14 UARTs
  - 7.14.1 Features
- 7.15 SPI serial I/O controller
  - 7.15.1 Features
- 7.16 SSP serial I/O controller
  - 7.16.1 Features
- 7.17 I2C-bus serial I/O controllers
  - 7.17.1 Features
- 7.18 I2S-bus serial I/O controllers
  - 7.18.1 Features
- 7.19 General purpose 32-bit timers/external event counters
  - 7.19.1 Features
- 7.20 Pulse width modulator
  - 7.20.1 Features
- 7.21 Watchdog timer
  - 7.21.1 Features
- 7.22 RTC and battery RAM
  - 7.22.1 Features
- 7.23 Clocking and power control
  - 7.23.1 Crystal oscillators
  - 7.23.2 PLL
  - 7.23.3 Wake-up timer
  - 7.23.4 Power control
- 7.24 System control
  - 7.24.1 Reset
  - 7.24.2 Brownout detection
  - 7.24.3 Code security (Code Read Protection - CRP)
  - 7.24.4 AHB
  - 7.24.5 External interrupt inputs
  - 7.24.6 Memory mapping control
- 7.25 Emulation and debugging
  - 7.25.1 EmbeddedICE
  - 7.25.2 Embedded trace
  - 7.25.3 RealMonitor
8. Limiting values
9. Thermal characteristics
10. Static characteristics
- 10.1 Power-down mode
- 10.2 Deep power-down mode
- 10.3 Electrical pin characteristics
11. Dynamic characteristics
- 11.1 Internal oscillators
- 11.2 I/O pins
- 11.3 USB interface
- 11.4 Flash memory
- 11.5 Timing
12. ADC electrical characteristics
13. DAC electrical characteristics
14. Application information
- 14.1 Suggested USB interface solutions
- 14.2 Crystal oscillator XTAL input and component selection
- 14.3 RTC 32 kHz oscillator component selection
- 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
- 14.5 Standard I/O pin configuration
- 14.6 Reset pin configuration
15. Package outline
16. Abbreviations
17. Revision history
18. Legal information
- 18.1 Data sheet status
- 18.2 Definitions
- 18.3 Disclaimers
- 18.4 Trademarks
19. Contact information
20. Contents

Product data sheet Rev. 5.1 — 15 October 2013 15 of 65

NXP Semiconductors

LPC2361/62

Single-chip 16-bit/32-bit MCU

7.4 Memory map

The LPC2361/2362 memory map incorporates several distinct regions as shown in

Figure 3

In addition, the CPU interrupt vectors may be remapped to allow them to reside in either

flash memory (default), boot ROM, or SRAM (see Section 7.24.6

Fig 3. LPC2361/2362 memory map

0.0 GB

1.0 GB

TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY (LPC2361)

TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY (LPC2362)

0x0000 0000

0x0000 FFFF

0x0001 0000

0x0001 FFFF

0x0002 0000

RESERVED FOR ON-CHIP MEMORY

8 kB LOCAL ON-CHIP STATIC RAM (LPC2361)

32 kB LOCAL ON-CHIP STATIC RAM (LPC2362)

RESERVED ADDRESS SPACE

0x4000 0000

0x4000 2000

0x4000 8000

0x7FD0 0000

0x7FE0 0000

0x7FD0 1FFF

0x7FE0 3FFF

0x4000 1FFF

0x4000 7FFF

2.0 GB

0x8000 0000

BOOT ROM AND BOOT FLASH

(BOOT FLASH REMAPPED FROM ON-CHIP FLASH)

3.0 GB 0xC000 0000

RESERVED ADDRESS SPACE

3.75 GB

4.0 GB

3.5 GB

AHB PERIPHERALS

APB PERIPHERALS

0xE000 0000

0xF000 0000

0xFFFF FFFF

GENERAL PURPOSE OR USB RAM (8 KB)

ETHERNET RAM (16 kB)

002aae283