Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Applications
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description
- 7.1 Architectural overview
- 7.2 On-chip flash programming memory
- 7.3 On-chip SRAM
- 7.4 Memory map
- 7.5 Interrupt controller
- 7.6 Pin connect block
- 7.7 General purpose DMA controller
- 7.8 Fast general purpose parallel I/O
- 7.9 Ethernet (LPC2362 only)
- 7.10 USB interface
- 7.11 CAN controller and acceptance filters
- 7.12 10-bit ADC
- 7.13 10-bit DAC
- 7.14 UARTs
- 7.15 SPI serial I/O controller
- 7.16 SSP serial I/O controller
- 7.17 I2C-bus serial I/O controllers
- 7.18 I2S-bus serial I/O controllers
- 7.19 General purpose 32-bit timers/external event counters
- 7.20 Pulse width modulator
- 7.21 Watchdog timer
- 7.22 RTC and battery RAM
- 7.23 Clocking and power control
- 7.24 System control
- 7.25 Emulation and debugging
- 8. Limiting values
- 9. Thermal characteristics
- 10. Static characteristics
- 11. Dynamic characteristics
- 12. ADC electrical characteristics
- 13. DAC electrical characteristics
- 14. Application information
- 15. Package outline
- 16. Abbreviations
- 17. Revision history
- 18. Legal information
- 19. Contact information
- 20. Contents
LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 3 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the RTC oscillator.
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
3. Applications
Industrial control
Medical systems
Protocol converter
Communications
4. Ordering information
4.1 Ordering options
[1] Available as general purpose SRAM for the LPC2361.
Table 1. Ordering information
Type number Package
Name Description Version
LPC2361FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm SOT407-1
LPC2362FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm SOT407-1
Table 2. Ordering options
Type number Flash
(kB)
SRAM (kB) Ethernet USB
device +
4kB
FIFO
GP
DMA
Channels Temp range
Local bus
Ethernet buffer
GP/USB
RTC
Total
CAN ADC DAC
LPC2361FBD100 64 8 16
[1]
8234- yes yes 2 6 1 40 C to +85 C
LPC2362FBD100 128 32 16 8 2 58 RMII yes yes 2 6 1 40 C to +85 C
