Datasheet

LPC2361_62 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 15 October 2013 57 of 65
NXP Semiconductors
LPC2361/62
Single-chip 16-bit/32-bit MCU
15. Package outline
Fig 27. Package outline SOT407-1 (LQFP100)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
0.5
16.25
15.75
1.15
0.85
7
0
o
o
0.08 0.080.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT407-1 136E20 MS-026
00-02-01
03-02-20
D
(1) (1)(1)
14.1
13.9
H
D
16.25
15.75
E
Z
1.15
0.85
D
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
25
c
D
H
b
p
E
H
A
2
v M
B
D
Z
D
A
Z
E
e
v M
A
X
1
100
76
75
51
50
26
y
pin 1 index
w M
w M
0 5 10 mm
scale
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1