Datasheet

LPC2387 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5.1 — 16 October 2013 62 of 66
NXP Semiconductors
LPC2387
Single-chip 16-bit/32-bit MCU
LPC2387 v.4 20110210 Product data sheet - LPC2387 v.3
Modifications:
• Table 3 “Pin description”: Added Table note 9 for XTAL1 and XTAL2 pins.
• Table 3 “Pin description”: Added Table note 10 for RTCX1 and RTCX2 pins.
• Table 4 “Limiting values”: Changed V
ESD
min/max to 2500/+2500.
• Table 7 “Static characteristics”: Removed R
pu
.
• Table 7 “Static characteristics”, Table note 13: Changed value from 18 to 33.
• Table 7 “Static characteristics”: Updated min, typical and max values for oscillator pins.
• Table 7 “Static characteristics”: Updated conditions and typical values for I
DD(DCDC)pd(3V3)
,
I
BATact
; added I
DD(DCDC)dpd(3V3)
and I
BAT
.
• Table 7 “Static characteristics”: Changed I
2
C-bus V
hys
typical from 0.5V
DD
to 0.05V
DD
.
• Section 2 “Features and benefits”: Added deep power-down information.
• Section 7.2 “On-chip flash programming memory” “On-chip flash programming memory”:
Removed text regarding flash endurance minimum specs.
• Section 7.23 “RTC and battery RAM”: Added deep power-down information.
• Section 7.24.2 “PLL”: Changed input clock frequency max to 25 MHz.
• Section 7.24.3 “Wake-up timer”: Added deep power-down information.
• Section 7.24.4 “Power control”: Added deep power-down information.
• Added Section 7.24.4.4 “Deep power-down mode”.
• Section 7.25.2 “Brownout detection”: Changed V
DD(3V3)
to V
DD(DCDC)(3V3)
.
• Added Section 9 “Thermal characteristics”.
• Added Section 10.1 “Power-down mode”.
• Added Section 10.2 “Deep power-down mode”.
• Added Section 10.3 “Electrical pin characteristics”.
• Added Section 11.1 “Internal oscillators”.
• Added Section 11.2 “I/O pins”.
• Added Section 11.4 “Flash memory”.
• Added Section 13 “DAC electrical characteristics”.
• Added Section 14.2 “Crystal oscillator XTAL input and component selection”.
• Added Section 14.3 “RTC 32 kHz oscillator component selection”.
• Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
• Added Section 14.5 “Standard I/O pin configuration”.
• Added Section 14.6 “Reset pin configuration”.
• Moved Figure 12 “External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)” to
below Table 8 “Dynamic characteristics”.
LPC2387 v.3 20081029 Product data sheet - LPC2387 v.2
Modifications:
• Added USB host/OTG features
• Table 4: changed storage temperature range from 40 C/125 C to 65 C/150 C.
• Table 6, V
hys
, moved 0.4 from Typ to Min column.
• Table 6, V
I
, added Table note 8.
• Table 6: updated Table note 10.
LPC2387 v.2 20080201 Product data sheet - LPC2387 v.1
LPC2387 v.1 20080114 Product data sheet - -
Table 19. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes