LPC2420/2460 Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 6.2 — 16 October 2013 Product data sheet 1. General description NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bit ARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG and embedded trace. The LPC2420/2460 is flashless. The LPC2420/2460 can execute both 32-bit ARM and 16-bit Thumb instructions.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller EMC provides support for asynchronous static memory devices such as RAM, ROM and flash, as well as dynamic memories such as single data rate SDRAM. Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts. General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP, I2S, and SD/MMC interface as well as for memory-to-memory transfers.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Each peripheral has its own clock divider for further power saving. These dividers help reduce active power by 20 % to 30 %. Brownout detect with separate thresholds for interrupt and forced reset. On-chip power-on reset. On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz. 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as the system clock.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 4.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 5.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 6. Pinning information 157 208 6.1 Pinning 1 156 LPC2420FBD208 LPC2460FBD208 105 53 104 52 002aad314 Fig 2. LPC2420/2460 pinning LQFP208 package ball A1 index area 2 1 4 3 6 5 8 7 9 10 12 14 16 11 13 15 17 A B C D E F G H LPC2420FET208 LPC2460FET208 J K L M N P R T U 002aad315 Transparent top view Fig 3. LPC2420/2460 pinning TFBGA208 package Table 3.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 3.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 3. Pin allocation table …continued Pin Symbol Pin Symbol Pin Symbol Pin Symbol Row H 1 P0[23]/AD0[0]/ I2SRX_CLK/CAP3[0] 2 P3[14]/D14 3 P3[30]/D30/ MAT1[1]/RTS1 4 VDD(DCDC)(3V3) 14 VSSIO 15 P2[8]/TD2/ TXD2/TRACEPKT3 16 P2[9]/ USB_CONNECT1/ RXD2/EXTIN0 17 P4[9]/A9 Row J 1 P3[6]/D6 2 VSSA 3 P3[31]/D31/MAT1[2] 4 n.c.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 3.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P0[3]/RXD0 204[1] D6[1] I/O P0[3] — General purpose digital input/output pin. I RXD0 — Receiver input for UART0. P0[4]/ I2SRX_CLK/ RD2/CAP2[0] 168[1] B12[1] I/O P0[4] — General purpose digital input/output pin. I/O I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P0[11]/RXD2/ SCL2/MAT3[1] 100[1] R14[1] I/O P0[11] — General purpose digital input/output pin. I RXD2 — Receiver input for UART2. I/O SCL2 — I2C2 clock input/output (this is not an open-drain pin).
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P0[19]/DSR1/ MCICLK/SDA1 122[1] L17[1] I/O P0[19] — General purpose digital input/output pin. I DSR1 — Data Set Ready input for UART1. O MCICLK — Clock output line for SD/MMC interface. I/O SDA1 — I2C1 data input/output (this is not an open-drain pin). I/O P0[20] — General purpose digital input/output pin.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P0[28]/SCL0 48[4] R3[4] I/O P0[28] — General purpose digital input/output pin. I/O SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus compliance). I/O P0[29] — General purpose digital input/output pin. I/O USB_D+1 — USB port 1 bidirectional D+ line. I/O P0[30] — General purpose digital input/output pin.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P1[7]/ ENET_COL/ MCIDAT1/ PWM0[5] 153[1] D14[1] I/O P1[7] — General purpose digital input/output pin. I ENET_COL — Ethernet Collision detect (MII interface) (LPC2460 only). I/O MCIDAT1 — Data line 1 for SD/MMC interface. O PWM0[5] — Pulse Width Modulator 0, output 5. I/O P1[8] — General purpose digital input/output pin.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P1[18]/ USB_UP_LED1/ PWM1[1]/ CAP1[0] 66[1] P7[1] I/O P1[18] — General purpose digital input/output pin. O USB_UP_LED1 — USB port 1 GoodLink LED indicator. It is LOW when device is configured (non-control endpoints enabled), or when host is enabled and has detected a device on the bus.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P1[26]/ USB_SSPND1/ PWM1[6]/ CAP0[0] 82[1] R10[1] I/O P1[26] — General purpose digital input/output pin. O USB_SSPND1 — USB port 1 Bus Suspend status (OTG transceiver). O PWM1[6] — Pulse Width Modulator 1, channel 6 output.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P2[3]/PWM1[4]/ DCD1/ PIPESTAT2 144[1] E16[1] I/O P2[3] — General purpose digital input/output pin. O PWM1[4] — Pulse Width Modulator 1, channel 4 output. I DCD1 — Data Carrier Detect input for UART1.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P2[12]/EINT2/ MCIDAT2/ I2STX_WS 106[6] N14[6] I/O P2[12] — General purpose digital input/output pin. I EINT2 — External interrupt 2 input. I/O MCIDAT2 — Data line 2 for SD/MMC interface. I/O I2STX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P2[25]/ CKEOUT1 54[1] R4[1] I/O P2[25] — General purpose digital input/output pin. O CKEOUT1 — SDRAM clock enable 1. P2[26]/ CKEOUT2/ MAT3[0]/MISO0 57[1] T4[1] I/O P2[26] — General purpose digital input/output pin. O CKEOUT2 — SDRAM clock enable 2. O MAT3[0] — Match output for Timer 3, channel 0. I/O MISO0 — Master In Slave Out for SSP0.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P3[8]/D8 191[1] D8[1] I/O P3[8] — General purpose digital input/output pin. I/O D8 — External memory data line 8. P3[9]/D9 199[1] C5[1] I/O P3[9] — General purpose digital input/output pin. I/O D9 — External memory data line 9. P3[10]/D10 205[1] B2[1] I/O P3[10] — General purpose digital input/output pin.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P3[21]/D21/ PWM0[6]/DTR1 175[1] C10[1] I/O P3[21] — General purpose digital input/output pin. I/O D21 — External memory data line 21. O PWM0[6] — Pulse Width Modulator 0, output 6.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P3[31]/D31/ MAT1[2] 25[1] J3[1] I/O P3[31] — General purpose digital input/output pin. I/O D31 — External memory data line 31. O MAT1[2] — Match output for Timer 1, channel 2. I/O Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P4[17]/A17 104[1] P14[1] I/O P4[17] — General purpose digital input/output pin. I/O A17 — External memory address line 17. P4[18]/A18 105[1] P15[1] I/O P4[18] — General purpose digital input/output pin. I/O A18 — External memory address line 18. P4[19]/A19 111[1] P16[1] I/O P4[19] — General purpose digital input/output pin.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P4[31]/CS1 193[1] A4[1] I/O P4[31] — General purpose digital input/output pin. O CS1 — LOW active Chip Select 1 signal. ALARM 37[7] N1[7] O ALARM — RTC controlled output. This is a 1.8 V pin. It goes HIGH when a RTC alarm is generated. USB_D2 52 U1 I/O USB_D2 — USB port 2 bidirectional D line.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description VDD(DCDC)(3V3) 26, 86, 174[7] H4, P11, D11[7] I 3.3 V DC-to-DC converter supply voltage: This is the power supply for the on-chip DC-to-DC converter. VDDA 20[7] G4[7] I analog 3.3 V pad supply voltage: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7. Functional description 7.1 Architectural overview The LPC2420/2460 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external memory, and the AMBA APB for connection to other on-chip peripheral functions.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller The Thumb set’s 16-bit instruction length allows it to approach higher density compared to standard ARM code while retaining most of the ARM’s performance. 7.2 On-chip SRAM The LPC2420/2460 includes a SRAM memory of 64 kB reserved for the ARM processor exclusive use. This RAM may be used for code and/or data storage and may be accessed as 8 bits, 16 bits, and 32 bits.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 4.0 GB 0xFFFF FFFF AHB PERIPHERALS 3.75 GB 0xF000 0000 APB PERIPHERALS 3.5 GB 0xE000 0000 EXTERNAL STATIC AND DYNAMIC MEMORY 2.0 GB 0x8000 0000 0x7FFF FFFF BOOT ROM RESERVED ADDRESS SPACE ON-CHIP STATIC RAM 1.0 GB 0x4000 0000 0x3FFF FFFF SPECIAL REGISTERS 0x3FFF 8000 RESERVED ADDRESS SPACE 0.0 GB 0x0000 0000 002aad316 Fig 4. LPC2420/2460 memory map 7.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller – Asynchronous page mode read – Programmable Wait States – Bus turnaround delay – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control CKE and CLKOUT to SDRAMs. • Dynamic memory self-refresh mode controlled by software. • Controller supports 2048, 4096, and 8192 row address synchronous memory parts.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • One AHB master for transferring data. This interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the peripheral. • Internal four-word FIFO per channel.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.9 Ethernet (LPC2460 only) The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller – Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter. • Physical interface: – Attachment of external PHY chip through standard MII or RMII interface. – PHY register access is available via the MIIM interface. 7.10 USB interface The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.10.2.1 Features • OHCI compliant. • Two downstream ports. • Supports per-port power switching. 7.10.3 USB OTG controller USB OTG is a supplement to the USB 2.0 specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • Acceptance Filter can provide FullCAN-style automatic reception for selected Standard Identifiers. • FullCAN messages can generate interrupts. 7.12 10-bit ADC The LPC2420/2460 contains one ADC. It is a single 10-bit successive approximation ADC with eight channels. 7.12.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • Fractional divider for baud rate control, auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). • UART3 includes an IrDA mode to support infrared communication. 7.15 SPI serial I/O controller The LPC2420/2460 contains one SPI controller.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.17.1 Features • The MCI provides all functions specific to the SD/MMC memory card. These include the clock generation unit, power management control, and command and data transfer. • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. • Can be used as a multimedia card bus or a secure digital memory card bus host.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S connection has one master, which is always the master, and one slave. The I2S interface on the LPC2420/2460 provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 7.19.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller – Do nothing on match. 7.21 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2420/2460. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that can be used by external hardware to restore chip power and resume operation. 7.23.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 7.24.2 for additional information. 7.24.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the RTC oscillator can be used to drive the PLL and the CPU. 7.24.2 PLL The PLL accepts an input clock frequency in the range of 32 kHz to 25 MHz.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.24.4 Power control The LPC2420/2460 supports a variety of power control features. There are four special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.24.4.4 Deep power-down mode Deep power-down mode is similar to the Power-down mode, but now the on-chip regulator that supplies power to the internal logic is also shut off. This produces the lowest possible power consumption without removing power from the entire chip.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.25 System control 7.25.1 Reset Reset has four sources on the LPC2420/2460: the RESET pin, the Watchdog reset, power-on reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable level, starts the wake-up timer (see description in Section 7.24.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.25.4 AHB The LPC2460 implements two AHB in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, is implemented on LPC2420 as well and includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 16 kB SRAM.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG interface to operate. 7.26.2 Embedded trace Since the LPC2420/2460 have significant amounts of on-chip memories, it is not possible to determine how the processor core is operating simply by observing the external pins. The ETM provides real-time trace capability for deeply embedded processor cores.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(3V3) supply voltage (3.3 V) core and external rail 3.0 3.6 V 3.0 3.6 V 0.5 +4.6 V 0.5 +4.6 V 0.5 +4.6 V 0.5 +5.1 V [2] 0.5 +6.0 V other I/O pins [2][3] 0.5 VDD(3V3) + 0.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: T j = T amb + P D R th j – a (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 10. Static characteristics Table 9. Static characteristics Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Min Typ[1] Max Unit supply voltage (3.3 V) core and external rail 3.0 3.3 3.6 V VDD(DCDC)(3V3) DC-to-DC converter supply voltage (3.3 V) 3.0 3.3 3.6 V VDDA analog 3.3 V pad supply voltage 3.0 3.3 3.6 V Vi(VBAT) input voltage on pin VBAT 2.0 3.3 3.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 9. Static characteristics …continued Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Min Typ[1] Max Unit - - 0.8 V 0.4 - - V VDD(3V3) 0.4 - - V [9] - - 0.4 V VOH = VDD(3V3) 0.4 V [9] 4 - - mA LOW-level output current VOL = 0.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 9. Static characteristics …continued Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Parameter Conditions Min Typ[1] Max Unit IOZ OFF-state output current 0 V < VI < 3.3 V - - 10 A VBUS bus supply voltage - - 5.25 V VDI differential input sensitivity voltage (D+) (D) 0.2 - - V VCM differential common mode voltage range includes VDI range 0.8 - 2.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 10.1 Power-down mode 002aae049 4 IDD(IO) (μA) 2 VDD(3V3) = 3.3 V VDD(3V3) = 3.0 V 0 −2 −4 −40 −15 10 35 60 85 temperature (°C) Vi(VBAT) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C. Fig 5. I/O maximum supply current IDD(IO) versus temperature in Power-down mode 002aae050 40 IBAT (μA) 30 Vi(VBAT) = 3.3 V Vi(VBAT) = 3.0 V 20 10 0 −40 −15 10 35 60 85 temperature (°C) VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C. Fig 6.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 002aae051 800 IDD(DCDC)pd(3v3) (μA) 600 400 VDD(DCDC)(3V3) = 3.3 V 200 0 −40 VDD(DCDC)(3V3) = 3.0 V −15 10 35 60 85 temperature (°C) VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C. Fig 7. Total DC-to-DC converter supply current IDD(DCDC)pd(3V3) at different temperatures in Power-down mode 10.2 Deep power-down mode 002aae046 300 IDD(IO) (μA) 200 100 VDD(3V3) = 3.3 V VDD(3V3) = 3.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 002aae047 40 IBAT (μA) 30 Vi(VBAT) = 3.3 V Vi(VBAT) = 3.0 V 20 10 0 −40 −15 10 35 60 85 temperature (°C) VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C Fig 9. RTC battery maximum supply current IBAT versus temperature in Deep power-down mode 002aae048 100 IDD(DCDC)dpd(3v3) (μA) 80 60 VDD(DCDC)(3V3) = 3.3 V 40 VDD(DCDC)(3V3) = 3.0 V 20 0 −40 −15 10 35 60 85 temperature (°C) VDD(3V3) = Vi(VBAT) = 3.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 10.3 Electrical pin characteristics 002aaf112 3.6 VOH (V) T = 85 °C 25 °C −40 °C 3.2 2.8 2.4 2.0 0 8 16 24 IOH (mA) Conditions: VDD(3V3) = 3.3 V; standard port pins. Fig 11. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH 002aaf111 15 IOL (mA) T = 85 °C 25 °C −40 °C 10 5 0 0 0.2 0.4 0.6 VOL (V) Conditions: VDD(3V3) = 3.3 V; standard port pins. Fig 12.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11. Dynamic characteristics Table 10. Dynamic characteristics Tamb = 40 C to +85 C for commercial applications; VDD(3V3) over specified ranges.[1] Symbol Parameter Conditions Typ[2] Min Max Unit External clock fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk) 0.4 - - ns tCLCX clock LOW time Tcy(clk) 0.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.1 Internal oscillators Table 11. Dynamic characteristic: internal oscillators Tamb = 40 C to +85 C; 3.0 V VDD(3V3) 3.6 V.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz fi(RTC) RTC input frequency - - 32.768 - kHz Max Unit [1] Parameters are valid over operating temperature range unless otherwise specified.
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors LPC2420_60 Product data sheet 11.4 Static external memory interface Table 14.
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Symbol Parameter Conditions Min Typ Max Unit 0.78 + Tcy(CCLK) 2.54 + Tcy(CCLK) 5.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.5 Dynamic external memory interface Table 15. Dynamic characteristics: Dynamic external memory interface CL = 30 pF, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, EMC Dynamic Read Config Register = 0x0 (RD = 00) Symbol Parameter Conditions Min Typ Max Unit 1.76 ns Common chip select valid delay time [1] - 1.05 th(S) chip select hold time [1] 0.1 1.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 16. Dynamic characteristics: Dynamic external memory interface CL = 30 pF on all pins, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.3 V, EMC Dynamic Read Config Register = 0x1 (RD = 01), Tcy(CCLK) = 1/CCLK Symbol Parameter Conditions Min Typ Max Unit Common td(SV) chip select valid delay time [1] - 3 + Tcy(CCLK) 1.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.6 Timing tCSLAV tCSHOEH CS addr tam th(D) data tCSLOEL tOELAV tOEHANV tOELOEH OE tCSHBLSH tBLSLAV BLS 002aad955 Fig 14. External memory read access CS tCSLAV tCSLWEL tWELWEH tBLSLBLSH BLS/WE tWEHANV tCSLBLSL tWELDV tBLSHANV addr tCSLDV tWEHDNV tBLSHDNV data OE 002aad956 Fig 15.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller TPERIOD crossover point extended crossover point differential data lines source EOP width: tFEOPT differential data to SE0/EOP skew n × TPERIOD + tFDEOP receiver EOP width: tEOPR1, tEOPR2 002aab561 Fig 16. Differential data-to-EOP transition skew and EOP width shifting edges SCK sampling edges MOSI MISO tsu(SPI_MISO) 002aad326 Fig 17.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 12. ADC electrical characteristics Table 17. ADC characteristics VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller offset error EO gain error EG 1023 1022 1021 1020 1019 1018 (2) 7 code out (1) 6 5 (5) 4 (4) 3 (3) 2 1 LSB (ideal) 1 0 1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024 VIA (LSBideal) offset error EO 1 LSB = Vi(VREF) − VSSA 1024 002aae604 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)).
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller LPC2XXX 20 kΩ AD0[y] AD0[y]SAMPLE 3 pF Rvsi 5 pF VEXT VSSIO, VSSCORE 002aad586 Fig 20. Suggested ADC interface - LPC2420/2460 AD0[y] pin LPC2420_60 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 16 October 2013 © NXP B.V. 2013. All rights reserved.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 13. DAC electrical characteristics Table 18. DAC electrical characteristics VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified Symbol Parameter ED Conditions Min Typ Max Unit differential linearity error - 1 - LSB EL(adj) integral non-linearity - 1.5 - LSB EO offset error - 0.6 - % EG gain error - 0.6 - % CL load capacitance - 200 - pF RL load resistance 1 - - k 14.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 14.2 Suggested USB interface solutions VDD(3V3) USB_UP_LED USB_CONNECT LPC24XX soft-connect switch R1 1.5 kΩ VBUS USB_D+ RS = 33 Ω USB-B connector USB_D− RS = 33 Ω VSSIO, VSSCORE 002aad587 Fig 23. LPC2420/2460 USB interface on a self-powered device VDD(3V3) R2 LPC24XX USB_UP_LED R1 1.5 kΩ VBUS USB_D+ RS = 33 Ω USB-B connector USB_D− RS = 33 Ω VSSIO, VSSCORE 002aad588 Fig 24.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD R1 R2 R3 R4 RSTOUT RESET_N VBUS ADR/PSW ID OE_N/INT_N VDD SPEED SUSPEND R4 R5 ISP1302 DP 33 Ω DM 33 Ω R6 VSSIO, VSSCORE SCL USB_SCL1 Mini-AB connector SDA USB_SDA1 USB_INT1 INT_N USB_D+1 USB_D−1 VDD USB_UP_LED1 LPC24XX R7 5V VDD IN USB_PPWR2 ENA LM3526-L OUTA FLAGA USB_OVRCR2 VBUS USB_PWRD2 USB_D+2 33 Ω D+ USB_D−2 33 Ω D− 15 kΩ 15 kΩ USB-A connector VSSIO, VSSCORE VDD USB_UP_LED2 R8
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD RSTOUT RESET_N OE_N/INT_N USB_TX_E1 USB_TX_DP1 DAT_VP USB_TX_DM1 SE0_VM RCV USB_RCV1 USB_RX_DP1 USB_RX_DM1 VP VBUS VM ID VDD ISP1302 LPC24XX ADR/PSW SPEED DP 33 Ω DM 33 Ω USB MINI-AB connector VSSIO, VSSCORE SUSPEND USB_SCL1 SCL USB_SDA1 SDA INT_N USB_INT1 VDD USB_UP_LED1 002aad590 Fig 26.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD USB_UP_LED1 VSSIO, VSSCORE USB_D+1 33 Ω D+ USB_D−1 33 Ω D− 15 kΩ USB-A connector 15 kΩ VDD VBUS USB_PWRD1 USB_OVRCR1 USB_PPWR1 FLAGA ENA 5V IN LM3526-L OUTA LPC24XX VDD USB_UP_LED2 VDD USB_CONNECT2 VSSIO, VSSCORE USB_D+2 33 Ω D+ USB_D−2 33 Ω D− VBUS USB-B connector VBUS 002aad595 Fig 27.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD USB_UP_LED1 VSSIO, VSSCORE USB_D+1 33 Ω D+ USB_D−1 33 Ω D− 15 kΩ USB-A connector 15 kΩ VDD VBUS USB_PWRD1 USB_OVRCR1 USB_PPWR1 FLAGA ENA OUTA 5V IN LPC24XX USB_PPWR2 LM3526-L ENB VDD OUTB FLAGB USB_OVRCR2 VBUS USB_PWRD2 USB_D+2 33 Ω D+ USB_D−2 33 Ω D− 15 kΩ USB-A connector VSSIO, VSSCORE 15 kΩ VDD USB_UP_LED2 002aad596 Fig 28.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 29), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTAL2 pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 30 and in Table 19 and Table 20.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 20. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF 20 pF < 100 39 pF, 39 pF 10 pF < 160 18 pF, 18 pF 20 pF < 80 39 pF, 39 pF 20 MHz to 25 MHz 14.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 14.5 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 14.7 Reset pin configuration VDD VDD VDD Rpu reset ESD 20 ns RC GLITCH FILTER PIN ESD VSS 002aaf274 Fig 33. Reset pin configuration LPC2420_60 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6.2 — 16 October 2013 © NXP B.V. 2013. All rights reserved.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 15. Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE (A 3) A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 28.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 16. Abbreviations Table 22.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 17. Revision history Table 23. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC2420_60 v.6.2 20131016 Product data sheet - LPC2420_60 v.6.1 Modifications: LPC2420_60 v.6.1 Modifications: LPC2420_60 Product data sheet • • • • Table 2 “Ordering options”: Corrected options for LPC2420FET208. Table 4 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 23. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC2420_60 v.6 20110823 Product data sheet - LPC2420_60 v.5 Modifications: LPC2420_60 v.5 Modifications: LPC2420_60 v.4 LPC2420_60 Product data sheet • • Table 4 “Pin description”: Updated description for USB_UP_LED1 and USB_UP_LED2.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 23. Revision history …continued Document ID Modifications: Release date • • • • • • • • • • • Data sheet status Change notice Supersedes Added LPC2420FET208. Added Deep power-down mode information. Table 6: Changed VESD min/max to 2500/+2500. Table 7: Updated conditions and typical values for IDD(DCDC)act(3V3). Table 7: Updated Table note 13. Table 7: Updated min, typical and max values for oscillator pins.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .
LPC2420/2460 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.5 11.6 12 13 14 14.1 14.2 14.3 14.4 14.5 14.6 14.7 15 16 17 18 18.1 18.2 18.3 18.4 19 20 Dynamic external memory interface . . . . . . . . Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADC electrical characteristics . . . . . . . . . . . . DAC electrical characteristics . . . . . . . . . . . . Application information. . . . . . . . . . . . . . . . . . Suggested boot memory interface solutions. .