Datasheet

LPC2420_60 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6.2 — 16 October 2013 82 of 87
NXP Semiconductors
LPC2420/2460
Flashless 16-bit/32-bit microcontroller
LPC2420_60 v.6 20110823 Product data sheet - LPC2420_60 v.5
Modifications:
• Table 4 “Pin description”: Updated description for USB_UP_LED1 and USB_UP_LED2.
• Table 4 “Pin description”: Added Table note 8 for DBGEN, TMS, TDI, TRST, and RTCK
pins.
• Table 4 “Pin description”: Added Table note 9 for TCK and TDO pins.
• Table 4 “Pin description”: Added Table note 11 for XTAL1 and XTAL2 pins.
• Table 4 “Pin description”: Added Table note 12 for RTCX1 and RTCX2 pins.
• Table 6 “Limiting values”: Added “non-operating” to conditions of storage spec.
• Table 6 “Limiting values”: Updated Table note [5].
• Added Table 8 “Thermal resistance value (C/W): ±15 %”.
• Table 9 “Static characteristics”: Removed R
pu
.
• Table 9 “Static characteristics”: Changed V
hys
Typ value of I
2
C-bus pins to 0.05V
DD(3V3)
.
• Added Table 11 “Dynamic characteristic: internal oscillators”.
• Added Table 12 “Dynamic characteristic: I/O pins[1]”.
• Table 14 “Dynamic characteristics: Static external memory interface”: Updated min, typical
and max values for t
h(D)
.
• Table 14 “Dynamic characteristics: Static external memory interface”: Updated min, typical
and max values for t
WEHDNV
.
• Table 14 “Dynamic characteristics: Static external memory interface”: Removed “AHB clock
= 1 MHz”.
• Table 14 “Dynamic characteristics: Static external memory interface”: Swapped current min
and max values for t
am
.
• Table 15 “Dynamic characteristics: Dynamic external memory interface”: Added Table
note 1.
• Table 15 “Dynamic characteristics: Dynamic external memory interface”: Removed “AHB
clock = 1 MHz”.
• Added Table 16 “Dynamic characteristics: Dynamic external memory interface”.
• Added Section 10.3 “Electrical pin characteristics”.
• Added Section 14.3 “Crystal oscillator XTAL input and component selection”.
• Added Section 14.4 “RTC 32 kHz oscillator component selection”.
• Updated Section 14.5 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
• Added Section 14.6 “Standard I/O pin configuration”
• Added Section 14.7 “Reset pin configuration”
• Moved Figure 13 “External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)”
to below Table 10 “Dynamic characteristics”.
• Updated Figure 19 “ADC characteristics”.
LPC2420_60 v.5 20100224 Preliminary data sheet - LPC2420_60 v.4
Modifications:
• Table 9: Merged power-down mode information into one table.
• Table 9: Changed typical values from 19 to 20 for I
DD(DCDC)dpd(3V3)
, I
BATact
, and I
BAT
.
• Added Table 16 “Dynamic characteristics: Dynamic external memory interface”.
• Added Table 18 “DAC electrical characteristics”.
LPC2420_60 v.4 20091015 Preliminary data sheet - LPC2420_60 v.3
Table 23. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes