Datasheet

LPC2458 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 4.1 — 15 October 2013 75 of 81
NXP Semiconductors
LPC2458
Single-chip 16-bit/32-bit micro
16. Soldering
Fig 32. Reflow soldering of the TFBGA180 package
DIMENSIONS in mm
PSLSPSRHxHy
Hx
Hy
SOT570-3
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA180 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot570-3_fr
0.80 0.400 0.400 0.550 12.575 12.575