Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 208 (28x28) 16/32-Bit 72 MHz I/O number 160

1. General description

NXP Semiconductors designed the LPC2470 microcontroller, powered by the

ARM7TDMI-S core, to be a highly integrated microcontroller for a wide range of

applications that require advanced communications and high quality graphic displays. The

LPC2470 microcontroller is flashless. The LPC2470, with real-time debug interfaces that

include both JTAG and embedded trace, can execute both 32-bit ARM and 16-bit Thumb

instructions.

The LPC2470 microcontroller incorporates an LCD controller, a 10/100 Ethernet Media

Access Controller (MAC), a USB full-speed device/host/OTG controller with 4 kB of

endpoint RAM, four UARTs, two Controller Area Network (CAN) channels, an SPI

interface, two Synchronous Serial Ports (SSP), three I

C interfaces, and an I

S interface.

Supporting this collection of serial communications interfaces are the following feature

components; an on-chip 4 MHz internal oscillator, 98 kB of total RAM consisting of 64 kB

of local SRAM, 16 kB SRAM for Ethernet, 16 kB SRAM for general purpose DMA, 2 kB of

battery powered SRAM, and an External Memory Controller (EMC). These features make

this device optimally suited for portable electronics and Point-of-Sale (POS) applications.

Complementing the many serial communication controllers, versatile clocking capabilities,

and memory features are various 32-bit timers, a 10-bit ADC, 10-bit DAC, two PWM units,

and up to 160 fast GPIO lines. The LPC2470 connects 64 of the GPIO pins to the

hardware based Vector Interrupt Controller (VIC), allowing the external inputs to generate

edge-triggered interrupts. All of these features make the LPC2470 particularly suitable for

industrial control and medical systems.

2. Features and benefits

 ARM7TDMI-S processor, running at up to 72 MHz.

 98 kB on-chip SRAM includes:

 64 kB of SRAM on the ARM local bus for high performance CPU access.

 16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.

 16 kB SRAM for general purpose DMA use also accessible by the USB.

 2 kB SRAM data storage powered from the Real-Time Clock (RTC) power domain.

 LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film

Transistors (TFT) displays.

 Dedicated DMA controller.

 Selectable display resolution (up to 1024  768 pixels).

 Supports up to 24-bit true-color mode.

 Dual Advanced High-performance Bus (AHB) system allows simultaneous Ethernet

DMA, and USB DMA with no contention.

LPC2470

Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD,

USB 2.0 device/host/OTG, external memory interface

Rev. 4.1 — 16 October 2013 Product data sheet

Summary of content (91 pages)

PAGE 1
LPC2470 Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface Rev. 4.1 — 16 October 2013 Product data sheet 1. General description NXP Semiconductors designed the LPC2470 microcontroller, powered by the ARM7TDMI-S core, to be a highly integrated microcontroller for a wide range of applications that require advanced communications and high quality graphic displays. The LPC2470 microcontroller is flashless.
PAGE 2
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller  EMC provides support for asynchronous static memory devices such as RAM, ROM and flash, as well as dynamic memories such as single data rate SDRAM.  Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts.  General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP, I2S-bus, and Secure Digital/MultiMediaCard (SD/MMC) interface as well as for memory-to-memory transfers.
PAGE 3
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller  Each peripheral has its own clock divider for further power saving. These dividers help reduce active power by 20 % to 30 %.  Brownout detect with separate thresholds for interrupt and forced reset.  On-chip power-on reset.  On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.  On-chip PLL allows CPU operation up to the maximum CPU rate without the need for a high frequency crystal.
PAGE 4
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 5.
PAGE 5
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 6. Pinning information 157 208 6.1 Pinning 1 156 LPC2470FBD208 105 53 104 52 Fig 2. 002aad318 LPC2470 pinning LQFP208 package ball A1 index area 2 1 4 3 6 5 8 7 9 10 12 14 16 11 13 15 17 A B C D E F G H LPC2470FET208 J K L M N P R T U 002aad319 Transparent top view Fig 3. Table 3.
PAGE 6
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 3.
PAGE 7
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 3. Pin allocation table …continued Pin Symbol Pin Symbol Pin Symbol Pin Symbol 14 15 P3[17]/D17/ PWM0[2]/RXD1 16 P2[5]/PWM1[6]/ DTR1/TRACEPKT0/ LCDLP 17 P3[16]/D16/ PWM0[1]/TXD1 P4[11]/A11 Row G 1 P3[5]/D5 2 P0[24]/AD0[1]/ I2SRX_WS/CAP3[1] 3 VDD(3V3) 4 VDDA 14 n.c.
PAGE 8
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 3.
PAGE 9
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 6.2 Pin description Table 4.
PAGE 10
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P0[7]/I2STX_CLK/ LCDVD[9]/SCK1/ MAT2[1] 162[1] C13[1] I/O P0[7] — General purpose digital input/output pin. I/O I2STX_CLK — I2S transmit clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification.[2] O LCDVD[9] — LCD data.[2] I/O SCK1 — Serial Clock for SSP1.
PAGE 11
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P0[14]/ USB_HSTEN2/ USB_CONNECT2/ SSEL1 69[1] T7[1] I/O P0[14] — General purpose digital input/output pin. O USB_HSTEN2 — Host Enabled status for USB port 2. O USB_CONNECT2 — SoftConnect control for USB port 2. Signal used to switch an external 1.5 k resistor under software control. Used with the SoftConnect USB feature.
PAGE 12
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P0[23]/AD0[0]/ I2SRX_CLK/ CAP3[0] 18[3] H1[3] I/O P0[23] — General purpose digital input/output pin. I AD0[0] — A/D converter 0, input 0. I/O I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. I CAP3[0] — Capture input for Timer 3, channel 0.
PAGE 13
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P1[3]/ ENET_TXD3/ MCICMD/ PWM0[2] 177[1] A10[1] I/O P1[3] — General purpose digital input/output pin. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I/O MCICMD — Command line for SD/MMC interface. O PWM0[2] — Pulse Width Modulator 0, output 2. P1[4]/ ENET_TX_EN 192[1] A5[1] I/O P1[4] — General purpose digital input/output pin.
PAGE 14
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P1[16]/ ENET_MDC 180[1] D10[1] I/O P1[16] — General purpose digital input/output pin. O ENET_MDC — Ethernet MIIM clock. P1[17]/ ENET_MDIO 178[1] A9[1] I/O P1[17] — General purpose digital input/output pin. I/O ENET_MDIO — Ethernet MIIM data input and output.
PAGE 15
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P1[24]/ USB_RX_DM1/ LCDVD[10]/ LCDVD[14]/ PWM1[5]/MOSI0 78[1] T9[1] I/O P1[24] — General purpose digital input/output pin. I USB_RX_DM1 — D receive data for USB port 1 (OTG transceiver).[7] O LCDVD[10]/LCDVD[14] — LCD data.[7] O PWM1[5] — Pulse Width Modulator 1, channel 5 output. I/O MOSI0 — Master Out Slave in for SSP0.
PAGE 16
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4.
PAGE 17
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P2[7]/RD2/ RTS1/ TRACEPKT2/ LCDVD[1]/ LCDVD[5] 136[1] G16[1] I/O P2[7] — General purpose digital input/output pin. I RD2 — CAN2 receiver input. O RTS1 — Request to Send output for UART1. O TRACEPKT2 — Trace Packet, bit 2.[8] O LCDVD[1]/LCDVD[5] — LCD data.
PAGE 18
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P2[14]/CS2/ CAP2[0]/SDA1 91[9] R12[9] I/O P2[14] — General purpose digital input/output pin. O CS2 — LOW active Chip Select 2 signal. I CAP2[0] — Capture input for Timer 2, channel 0. I/O SDA1 — I2C1 data input/output (this is not an open-drain pin). I/O P2[15] — General purpose digital input/output pin. O CS3 — LOW active Chip Select 3 signal.
PAGE 19
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P2[28]/ DQMOUT0 49[1] P4[1] I/O P2[28] — General purpose digital input/output pin. O DQMOUT0 — Data mask 0 used with SDRAM and static devices. P2[29]/ DQMOUT1 43[1] N3[1] I/O P2[29] — General purpose digital input/output pin. O DQMOUT1 — Data mask 1 used with SDRAM and static devices.
PAGE 20
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P3[13]/D13 7[1] C1[1] I/O P3[13] — General purpose digital input/output pin. I/O D13 — External memory data line 13. P3[14]/D14 21[1] H2[1] I/O P3[14] — General purpose digital input/output pin. I/O D14 — External memory data line 14. On POR, this pin serves as the BOOT0 pin. I/O P3[15] — General purpose digital input/output pin.
PAGE 21
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P3[23]/D23/ CAP0[0]/ PCAP1[0] 65[1] T6[1] I/O P3[23] — General purpose digital input/output pin. I/O D23 — External memory data line 23. I CAP0[0] — Capture input for Timer 0, channel 0. I PCAP1[0] — Capture input for PWM1, channel 0. P3[24]/D24/ CAP0[1]/ PWM1[1] 58[1] I/O P3[24] — General purpose digital input/output pin.
PAGE 22
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P4[1]/A1 79[1] U10[1] I/O P4[1] — General purpose digital input/output pin. I/O A1 — External memory address line 1. P4[2]/A2 83[1] T11[1] I/O P4[2] — General purpose digital input/output pin. I/O A2 — External memory address line 2. P4[3]/A3 97[1] U16[1] I/O P4[3] — General purpose digital input/output pin.
PAGE 23
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description P4[20]/A20/ SDA2/SCK1 109[1] R17[1] I/O P4[20] — General purpose digital input/output pin. I/O A20 — External memory address line 20. I/O SDA2 — I2C2 data input/output (this is not an open-drain pin). P4[21]/A21/ SCL2/SSEL1 P4[22]/A22/ TXD2/MISO1 P4[23]/A23/ RXD2/MOSI1 115[1] 123[1] 129[1] M15[1] K14[1] J15[1] I/O SCK1 — Serial Clock for SSP1.
PAGE 24
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description DBGEN 9[1][16] F4[1][16] I DBGEN — JTAG interface control signal. Also used for boundary scanning. TDO 2[1][17] D3[1][17] O TDO — Test Data Out for JTAG interface. TDI 4[1][16] C2[1][16] I TDI — Test Data In for JTAG interface. TMS 6[1][16] E3[1][16] I TMS — Test Mode Select for JTAG interface.
PAGE 25
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 4. Pin description …continued Symbol Pin Ball Type Description VREF 24[13] K1[13] I ADC reference: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. The level on this pin is used as a reference for ADC and DAC. VBAT 38[13] M3[13] I RTC power supply: 3.3 V on this pin supplies the power to the RTC peripheral.
PAGE 26
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7. Functional description 7.1 Architectural overview The LPC2470 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external memory, and the AMBA APB for connection to other on-chip peripheral functions.
PAGE 27
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller The Thumb set’s 16-bit instruction length allows it to approach higher density compared to standard ARM code while retaining most of the ARM’s performance. 7.2 On-chip SRAM The LPC2470 includes a SRAM memory of 64 kB reserved for the ARM processor exclusive use. This RAM may be used for code and/or data storage and may be accessed as 8 bits, 16 bits, and 32 bits.
PAGE 28
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 4.0 GB 0xFFFF FFFF AHB PERIPHERALS 3.75 GB 0xF000 0000 APB PERIPHERALS 3.5 GB 0xE000 0000 EXTERNAL STATIC AND DYNAMIC MEMORY 2.0 GB 0x8000 0000 0x7FFF FFFF BOOT ROM RESERVED ADDRESS SPACE ON-CHIP STATIC RAM 1.0 GB 0x4000 0000 0x3FFF FFFF SPECIAL REGISTERS 0x3FFF 8000 RESERVED ADDRESS SPACE 0.0 GB 0x0000 0000 002aad316 Fig 4. LPC2470 memory map 7.
PAGE 29
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority.
PAGE 30
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller – Asynchronous page mode read – Programmable Wait States – Bus turnaround delay – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control CKE and CLKOUT to SDRAMs. • Dynamic memory self-refresh mode controlled by software. • Controller supports 2048, 4096, and 8192 row address synchronous memory parts.
PAGE 31
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • One AHB master for transferring data. This interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the peripheral. • Internal four-word FIFO per channel.
PAGE 32
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.9 LCD controller The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024  768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode.
PAGE 33
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC2470 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access off-chip memory via the EMC, as well as the SRAM located on another AHB.
PAGE 34
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.11 USB interface The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller.
PAGE 35
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.11.3 USB OTG controller USB OTG is a supplement to the USB 2.0 specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. The OTG controller integrates the host controller, device controller, and a master-only I2C interface to implement OTG dual-role device functionality. The dedicated I2C interface controls an external OTG transceiver. 7.11.
PAGE 36
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.13 10-bit ADC The LPC2470 contains one ADC. It is a single 10-bit successive approximation ADC with eight channels. 7.13.1 Features • • • • • • • • 10-bit successive approximation ADC Input multiplexing among 8 pins Power-down mode Measurement range 0 V to Vi(VREF) 10-bit conversion time  2.
PAGE 37
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • UART3 includes an IrDA mode to support infrared communication. 7.16 SPI serial I/O controller The LPC2470 contains one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer.
PAGE 38
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. • Can be used as a multimedia card bus or a secure digital memory card bus host. The SD/MMC can be connected to several multimedia cards or a single secure digital memory card. • DMA supported through the GPDMA controller. 7.19 I2C-bus serial I/O controller The LPC2470 contains three I2C-bus controllers.
PAGE 39
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.20.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1, 48) kHz. • • • • Configurable word select period in master mode (separately for I2S input and output).
PAGE 40
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.22 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2470. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers.
PAGE 41
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses.
PAGE 42
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that can be used by external hardware to restore chip power and resume operation. 7.24.
PAGE 43
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 7.25.2 for additional information. 7.25.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the RTC oscillator can be used to drive the PLL and the CPU. 7.25.2 PLL The PLL accepts an input clock frequency in the range of 32 kHz to 25 MHz.
PAGE 44
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.25.4 Power control The LPC2470 supports a variety of power control features. There are four special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value.
PAGE 45
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 7.25.4.4 Deep power-down mode Deep power-down mode is similar to the Power-down mode, but now the on-chip regulator that supplies power to the internal logic is also shut off. This produces the lowest possible power consumption without removing power from the entire chip.
PAGE 46
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller level, starts the wake-up timer (see description in Section 7.25.3 “Wake-up timer”), causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, and a fixed number of clocks have passed. Once the internal reset is removed, all of the processor and peripheral registers have been initialized to predetermined values and the LPC2470 continues with booting from an external static memory. 7.26.
PAGE 47
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. 7.26.5 External interrupt inputs The LPC2470 includes up to 68 edge sensitive interrupt inputs combined with up to four level sensitive external interrupt inputs as selectable pin functions.
PAGE 48
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller information about processor execution to a trace port. A software debugger allows configuration of the ETM using a JTAG interface and displays the trace information that has been captured. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port.
PAGE 49
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(3V3) supply voltage (3.3 V) core and external rail 3.0 3.6 V 3.0 3.6 V 0.5 +4.6 V 0.5 +4.6 V 0.5 +4.6 V 0.5 +5.1 V [2] 0.5 +6.0 V other I/O pins [2][3] 0.5 VDD(3V3) + 0.5 V per supply pin [4] - 100 mA - 100 mA 65 +150 C - 1.
PAGE 50
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: T j = T amb +  P D  R th  j – a   (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD.
PAGE 51
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 10. Static characteristics Table 9. Static characteristics Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD(3V3) supply voltage (3.3 V) core and external rail 3.0 3.3 3.6 V VDD(DCDC)(3V3) DC-to-DC converter supply voltage (3.3 V) 3.0 3.3 3.6 V VDDA analog 3.3 V pad supply voltage 3.0 3.3 3.
PAGE 52
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 9. Static characteristics …continued Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter VIL LOW-level input voltage Conditions Min Typ[1] Max Unit - - 0.8 V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage IOH = 4 mA [9] VDD(3V3)  0.4 - - V VOL LOW-level output voltage IOL = 4 mA [9] - - 0.
PAGE 53
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 9. Static characteristics …continued Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 +1.8 +1.95 V Vo(XTAL2) output voltage on pin XTAL2 0.5 +1.8 +1.95 V Vi(RTCX1) input voltage on pin RTCX1 0.5 +1.8 +1.95 V Vo(RTCX2) output voltage on pin RTCX2 0.5 +1.8 +1.
PAGE 54
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 10.1 Power-down mode 002aae049 4 IDD(IO) (μA) 2 VDD(3V3) = 3.3 V VDD(3V3) = 3.0 V 0 −2 −4 −40 −15 10 35 60 85 temperature (°C) Vi(VBAT) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C. Fig 5. I/O maximum supply current IDD(IO) versus temperature in Power-down mode 002aae050 40 IBAT (μA) 30 Vi(VBAT) = 3.3 V Vi(VBAT) = 3.0 V 20 10 0 −40 −15 10 35 60 85 temperature (°C) VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C. Fig 6.
PAGE 55
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 002aae051 800 IDD(DCDC)pd(3v3) (μA) 600 400 VDD(DCDC)(3V3) = 3.3 V 200 0 −40 VDD(DCDC)(3V3) = 3.0 V −15 10 35 60 85 temperature (°C) VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C. Fig 7. Total DC-to-DC converter supply current IDD(DCDC)pd(3V3) at different temperatures in Power-down mode 10.2 Deep power-down mode 002aae046 300 IDD(IO) (μA) 200 100 VDD(3V3) = 3.3 V VDD(3V3) = 3.
PAGE 56
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 002aae047 40 IBAT (μA) 30 Vi(VBAT) = 3.3 V Vi(VBAT) = 3.0 V 20 10 0 −40 −15 10 35 60 85 temperature (°C) VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C Fig 9. RTC battery maximum supply current IBAT versus temperature in Deep power-down mode 002aae048 100 IDD(DCDC)dpd(3v3) (μA) 80 60 VDD(DCDC)(3V3) = 3.3 V 40 VDD(DCDC)(3V3) = 3.0 V 20 0 −40 −15 10 35 60 85 temperature (°C) VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C.
PAGE 57
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 10.3 Electrical pin characteristics 002aaf112 3.6 VOH (V) T = 85 °C 25 °C −40 °C 3.2 2.8 2.4 2.0 0 8 16 24 IOH (mA) Conditions: VDD(3V3) = 3.3 V; standard port pins. Fig 11. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH 002aaf111 15 IOL (mA) T = 85 °C 25 °C −40 °C 10 5 0 0 0.2 0.4 0.6 VOL (V) Conditions: VDD(3V3) = 3.3 V; standard port pins. Fig 12.
PAGE 58
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11. Dynamic characteristics Table 10. Dynamic characteristics Tamb = 40 C to +85 C for commercial applications; VDD(3V3) over specified ranges.[1] Symbol Parameter Conditions Typ[2] Min Max Unit External clock fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk)  0.4 - - ns tCLCX clock LOW time Tcy(clk)  0.
PAGE 59
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.1 Internal oscillators Table 11. Dynamic characteristic: internal oscillators Tamb = 40 C to +85 C; 3.0 V  VDD(3V3)  3.6 V.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz fi(RTC) RTC input frequency - - 32.768 - kHz Max Unit [1] Parameters are valid over operating temperature range unless otherwise specified.
PAGE 60
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx NXP Semiconductors LPC2470 Product data sheet 11.4 Static external memory interface Table 14.
PAGE 61
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Symbol Parameter Conditions Min Typ Max Unit 0.78 + Tcy(CCLK) 2.54 + Tcy(CCLK) 5.
PAGE 62
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.5 Dynamic external memory interface Table 15. Dynamic characteristics: Dynamic external memory interface CL = 30 pF, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, EMC Dynamic Read Config Register = 0x0 (RD = 00) Symbol Parameter Conditions Min Typ Max Unit 1.05 1.76 ns Common chip select valid delay time [1] - th(S) chip select hold time [1] 0.1 1.
PAGE 63
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 16. Dynamic characteristics: Dynamic external memory interface CL = 30 pF on all pins, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.3 V, EMC Dynamic Read Config Register = 0x1 (RD = 01), Tcy(CCLK) = 1/CCLK Symbol Parameter Conditions Min Typ Max Unit 3 + Tcy(CCLK) 1.
PAGE 64
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.6 Timing tCSLAV tCSHOEH CS addr tam th(D) data tCSLOEL tOELAV tOEHANV tOELOEH OE tCSHBLSH tBLSLAV BLS 002aad955 Fig 14. External memory read access CS tCSLAV tCSLWEL tWELWEH tBLSLBLSH BLS/WE tWEHANV tCSLBLSL tWELDV tBLSHANV addr tCSLDV tWEHDNV tBLSHDNV data OE 002aad956 Fig 15. External memory write access LPC2470 Product data sheet All information provided in this document is subject to legal disclaimers.
PAGE 65
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller TPERIOD crossover point extended crossover point differential data lines source EOP width: tFEOPT differential data to SE0/EOP skew n × TPERIOD + tFDEOP receiver EOP width: tEOPR1, tEOPR2 002aab561 Fig 16. Differential data-to-EOP transition skew and EOP width shifting edges SCK sampling edges MOSI MISO tsu(SPI_MISO) 002aad326 Fig 17.
PAGE 66
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 12. ADC electrical characteristics Table 17. ADC static characteristics VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz.
PAGE 67
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller offset error EO gain error EG 1023 1022 1021 1020 1019 1018 (2) 7 code out (1) 6 5 (5) 4 (4) 3 (3) 2 1 LSB (ideal) 1 0 1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024 VIA (LSBideal) offset error EO 1 LSB = Vi(VREF) − VSSA 1024 002aae604 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)).
PAGE 68
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller LPC2XXX 20 kΩ AD0[y] AD0[y]SAMPLE 3 pF Rvsi 5 pF VEXT VSSIO, VSSCORE 002aad586 Fig 20. Suggested ADC interface - LPC2470 AD0[y] pin LPC2470 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.1 — 16 October 2013 © NXP B.V. 2013. All rights reserved.
PAGE 69
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 13. DAC electrical characteristics Table 18. DAC electrical characteristics VDDA = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified Symbol Parameter ED Conditions Min Typ Max Unit differential linearity error - 1 - LSB EL(adj) integral non-linearity - 1.5 - LSB EO offset error - 0.6 - % EG gain error - 0.6 - % CL load capacitance - 200 - pF RL load resistance 1 - - k 14.
PAGE 70
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 19.
PAGE 71
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 20.
PAGE 72
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 21.
PAGE 73
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller CS1 OE CE WE OE WE UB BLS1 LB BLS0 16-bit MEMORY IO[15:0] D[15:0] A[a_m:0] A[a_b:1] 002aad323 Fig 22. Booting from a single 16-bit memory chip 14.3 Suggested USB interface solutions VDD(3V3) USB_UP_LED USB_CONNECT LPC24XX soft-connect switch R1 1.5 kΩ VBUS USB_D+ RS = 33 Ω USB_D− USB-B connector RS = 33 Ω VSSIO, VSSCORE 002aad587 Fig 23.
PAGE 74
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD(3V3) R2 LPC24XX USB_UP_LED R1 1.5 kΩ VBUS USB_D+ RS = 33 Ω USB-B connector USB_D− RS = 33 Ω VSSIO, VSSCORE 002aad588 Fig 24. LPC2470 USB interface on a bus-powered device LPC2470 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.1 — 16 October 2013 © NXP B.V. 2013. All rights reserved.
PAGE 75
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD R1 R2 R3 R4 RSTOUT RESET_N VBUS ADR/PSW ID OE_N/INT_N VDD SPEED SUSPEND R4 R5 ISP1302 DP 33 Ω DM 33 Ω R6 VSSIO, VSSCORE SCL USB_SCL1 Mini-AB connector SDA USB_SDA1 USB_INT1 INT_N USB_D+1 USB_D−1 VDD USB_UP_LED1 LPC24XX R7 5V VDD IN USB_PPWR2 ENA LM3526-L OUTA FLAGA USB_OVRCR2 VBUS USB_PWRD2 USB_D+2 33 Ω D+ USB_D−2 33 Ω D− 15 kΩ 15 kΩ USB-A connector VSSIO, VSSCORE VDD USB_UP_LED2 R8 002
PAGE 76
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD RSTOUT RESET_N OE_N/INT_N USB_TX_E1 USB_TX_DP1 DAT_VP USB_TX_DM1 SE0_VM RCV USB_RCV1 USB_RX_DP1 USB_RX_DM1 VP VBUS VM ID VDD ISP1302 LPC24XX ADR/PSW SPEED DP 33 Ω DM 33 Ω USB MINI-AB connector VSSIO, VSSCORE SUSPEND USB_SCL1 SCL USB_SDA1 SDA INT_N USB_INT1 VDD USB_UP_LED1 002aad590 Fig 26.
PAGE 77
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD USB_UP_LED1 VSSIO, VSSCORE USB_D+1 33 Ω D+ USB_D−1 33 Ω D− 15 kΩ USB-A connector 15 kΩ VDD VBUS USB_PWRD1 USB_OVRCR1 USB_PPWR1 FLAGA ENA 5V IN LM3526-L OUTA LPC24XX VDD USB_UP_LED2 VDD USB_CONNECT2 VSSIO, VSSCORE USB_D+2 33 Ω D+ USB_D−2 33 Ω D− VBUS USB-B connector VBUS 002aad595 Fig 27.
PAGE 78
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller VDD USB_UP_LED1 VSSIO, VSSCORE USB_D+1 33 Ω D+ USB_D−1 33 Ω D− 15 kΩ USB-A connector 15 kΩ VDD VBUS USB_PWRD1 USB_OVRCR1 USB_PPWR1 FLAGA ENA OUTA 5V IN LPC24XX USB_PPWR2 LM3526-L ENB VDD OUTB FLAGB USB_OVRCR2 VBUS USB_PWRD2 USB_D+2 33 Ω D+ USB_D−2 33 Ω D− 15 kΩ USB-A connector VSSIO, VSSCORE 15 kΩ VDD USB_UP_LED2 002aad596 Fig 28. LPC2470 USB OTG port configuration: USB port 1 host, USB port 2 host 14.
PAGE 79
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 29), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTAL2 pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 30 and in Table 22 and Table 23.
PAGE 80
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 23. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180  18 pF, 18 pF 20 pF < 100  39 pF, 39 pF 10 pF < 160  18 pF, 18 pF 20 pF < 80  39 pF, 39 pF 20 MHz to 25 MHz 14.
PAGE 81
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 14.6 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors CX1, CX2, and CX3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain.
PAGE 82
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 14.8 Reset pin configuration VDD VDD VDD Rpu reset ESD 20 ns RC GLITCH FILTER PIN ESD VSS 002aaf274 Fig 33. Reset pin configuration LPC2470 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4.1 — 16 October 2013 © NXP B.V. 2013. All rights reserved.
PAGE 83
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 15. Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE (A 3) A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 28.1 27.
PAGE 84
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.
PAGE 85
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 16. Abbreviations Table 25.
PAGE 86
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 17. Revision history Table 26. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC2470 v.4.1 20131016 Product data sheet - LPC2470 v.4 Modifications: LPC2470 v.4 Modifications: LPC2470 Product data sheet • • • Table 4 “Pin description”, Table note 9: Changed glitch filter spec from 5 ns to 10 ns. Table 10 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.
PAGE 87
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Table 26. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC2470 v.3 20110214 Product data sheet - LPC2470 v.2 Modifications: • • • • • • • • • • • LPC2470 v.2 Modifications: LPC2470 v.1 LPC2470 Product data sheet Changed data sheet status to Product data sheet. Table 4 “Pin description”: Added Table note 14 for XTAL1 and XTAL2 pins.
PAGE 88
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
PAGE 89
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
PAGE 90
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 91
LPC2470 NXP Semiconductors Flashless 16-bit/32-bit microcontroller 11.4 11.5 11.6 12 13 14 14.1 14.2 14.3 14.4 14.5 14.6 14.7 14.8 15 16 17 18 18.1 18.2 18.3 18.4 19 20 Static external memory interface . . . . . . . . . . Dynamic external memory interface . . . . . . . . Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADC electrical characteristics . . . . . . . . . . . . DAC electrical characteristics . . . . . . . . . . . . Application information. . . . . . . . . . . . . . . . .