- NXP ARM Microcontroller Product Data Sheet
Table Of Contents
- 1. Introduction
- 2. General description
- 3. Features
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description
- 8. Block description
- 9. Limiting values
- 10. Thermal characteristics
- 11. Static characteristics
- 12. Dynamic characteristics
- 13. Package outline
- 14. Soldering
- 15. Abbreviations
- 16. References
- 17. Revision history
- 18. Legal information
- 19. Contact information
- 20. Contents
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LPC2917_19_1 © NXP B.V. 2007. All rights reserved.
Preliminary data sheet Rev. 1.01 — 15 November 2007 21 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
Usage of the idle/turn-around time (IDCY) is demonstrated In Figure 6. Extra wait states
are added between a read and a write cycle in the same external memory device.
Address pins on the device are shared with other functions. When connecting external
memories, check that the I/O pin is programmed for the correct function. Control of these
settings is handled by the SCU.
WSTOEN=5, WSTWEN=5, WST1=7, WST2=6, IDCY=5
Fig 6. Reading/writing external memory
OE_N
CLK(SYS)
CS
ADDR
DATA
WSTOEN
WST1
WSTWEN
WST2
WE_N / BLS
IDCY