- NXP ARM Microcontroller Product Data Sheet
Table Of Contents
- 1. Introduction
- 2. General description
- 3. Features
- 4. Ordering information
- 5. Block diagram
- 6. Pinning information
- 7. Functional description
- 8. Block description
- 9. Limiting values
- 10. Thermal characteristics
- 11. Static characteristics
- 12. Dynamic characteristics
- 13. Package outline
- 14. Soldering
- 15. Abbreviations
- 16. References
- 17. Revision history
- 18. Legal information
- 19. Contact information
- 20. Contents
DR
AFT
DR
AFT
DRAFT
DR
D
RAFT
DRAFT
DRA
F
T DRAF
D
RAFT DRAFT DRAFT DRAFT DRAFT D
DRAFT
D
RAFT DRA
F
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LPC2917_19_1 © NXP B.V. 2007. All rights reserved.
Preliminary data sheet Rev. 1.01 — 15 November 2007 58 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
13. Package outline
Fig 15. Package outline SOT486-1 (LQFP144)
UNIT A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
0.5
22.15
21.85
1.4
1.1
7
0
o
o
0.080.2 0.081
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT486-1 136E23 MS-026
00-03-14
03-02-20
D
(1) (1)(1)
20.1
19.9
H
D
22.15
21.85
E
Z
1.4
1.1
D
0 5 10 mm
scale
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
c
b
p
E
H
A
2
D
H
v M
B
D
Z
D
A
Z
E
e
v M
A
X
y
w M
w M
A
max.
1.6
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
108
109
pin 1 index
73
72
37
1
144
36
