Datasheet

LPC3141_43 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 4 June 2012 2 of 69
NXP Semiconductors
LPC3141/3143
Low-cost, low-power ARM926EJ microcontrollers
 Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
 On the LPC3143 only: secure booting using an AES decryption engine from SPI
flash, NAND flash, SD/MMC cards, UART, or USB.
 DMA controller
 Four 32-bit timers
 Watchdog timer
 PWM module
 Master/slave PCM interface
 Random Number Generator (RNG)
 General Purpose I/O pins (GPIO)
 Flexible and versatile interrupt structure
 JTAG interface with boundary scan and ARM debug access
 Operating voltage and temperature
 Core voltage: 1.2 V
 I/O voltages: 1.8 V, 3.3 V
 Temperature: 40 C to +85 C
 TFBGA180 package: 12
x 12 mm, 0.8 mm pitch
3. Ordering information
3.1 Ordering options
Table 1. Ordering information
Type number Package
Name Description Version
LPC3141FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12  12  0.8 mm SOT570-3
LPC3143FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12  12  0.8 mm SOT570-3
Table 2. Ordering options for LPC3141/3143
Type number Core/bus
frequency
Total
SRAM
Security
engine
AES
High-speed USB 10-bit
ADC
channels
I
2
S/
I
2
C
MCI
SDHC/
SDIO/
CE-ATA
Temperature
range
LPC3141FET180 270/
90 MHz
192 kB no Device/
Host/OTG
4 2 each yes 40 C to +85 C
LPC3143FET180 270/
90 MHz
192 kB yes Device/
Host/OTG
4 2 each yes 40 C to +85 C