Datasheet

LPC3141_43 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 4 June 2012 8 of 69
NXP Semiconductors
LPC3141/3143
Low-cost, low-power ARM926EJ microcontrollers
Serial Peripheral Interface (SPI)
SPI_CS_OUT0
[4]
A7 SUP3 DO O DIO4 SPI chip select output (master).
SPI_SCK
[4]
A8 SUP3 DIO I DIO4 SPI clock input (slave)/clock output (master).
SPI_MISO
[4]
C8 SUP3 DIO I DIO4 SPI data input (master)/data output (slave).
SPI_MOSI
[4]
B7 SUP3 DIO I DIO4 SPI data output (master)/data input (slave).
SPI_CS_IN
[4]
B8 SUP3 DI I DIO4 SPI chip select input (slave).
Digital power supply
VDDI H3;
L7;
L12;
C12;
C6
SUP1 Supply - CS2 Digital core supply.
VSSI A11;
C7;
D12;
G4;
L6;
L11
Ground - CG2 Digital core ground.
Peripheral power supply
VDDE_IOA B2;
E5;
F5;
G5;
H5
SUP4 Supply - PS1 Peripheral supply for NAND flash interface.
VDDE_IOB L4;
M5;
M7;
M9
SUP8 Supply - PS1 Peripheral supply for SDRAM/LCD.
VDDE_IOC C13;
D5;
D7;
E8;
G12;
L10;
K11
SUP3 Supply - PS1 Peripheral supply.
VSSE_IOA C3;
C4;
E4;
F4;
H4;
K3
- Ground - PG1 -
VSSE_IOB M3;
M4;
M6;
M8
- Ground - PG1 -
Table 4. Pin description
…continued
Pin names with prefix m are multiplexed pins. See Table 10 for pin function selection of multiplexed pins.
Pin name BGA
Ball
Digital
I/O
level
[1]
Application
function
Pin
state
after
reset
[2]
Cell type
[3]
Description