Datasheet
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LPC3152_3154 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Preliminary data sheet Rev. 0.12 — 27 May 2010 2 of 88
NXP Semiconductors
LPC3152/3154
Three-channel 10-bit ADC
Integrated 4/8/16-bit 6800/8080 compatible LCD interface
Integrated audio codec with stereo ADC and Class AB headphone amplifier
System functions
Dynamic clock gating and scaling
Multiple power domains
Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
On the LPC3154 only: secure booting using AES decryption engine from SPI flash,
NAND flash, SD/MMC cards, UART, or USB
DMA controller
Four 32-bit timers
Watchdog timer
PWM module
Master/slave PCM interface
Random Number Generator (RNG)
General Purpose I/O (GPIO) pins
Flexible and versatile interrupt structure
JTAG interface with boundary scan and ARM debug access
Real-Time Clock (RTC)
Power supply
Integrated power supply unit
Li-ion charger
USB charge pump
Operating voltage and temperature
Core voltage: 1.2 V
I/O voltage: 1.8 V, 3.3 V
Temperature: −40 °C to +85 °C
TFBGA208 package: 12 × 12 mm
2
, 0.7 mm pitch
3. Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
LPC3152FET208 TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls;
body 12 x 12 x 0.7 mm
sot930-1
LPC3154FET208 TFBGA208 TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls;
body 12 x 12 x 0.7 mm
sot930-1