Datasheet

DR
AFT
DR
AFT
DRAFT
DR
D
RAFT
DRAFT
DRA
F
T DRAF
D
RAFT DRAFT DRAFT DRAFT DRAFT D
DRAFT
D
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LPC3152_3154 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Preliminary data sheet Rev. 0.12 — 27 May 2010 40 of 88
NXP Semiconductors
LPC3152/3154
• Audio codec on the analog die (see Section 7.2):
– Class AB amplifier
– Stereo Analog-to-Digital Converter (SADC)
– analog inputs/outputs
– Analog Volume Control (AVC)
– Stereo Digital-to-Analog Converter (SDAC)
• I
2
S and I
2
C interfaces on the analog die for communication with the digital die.
6.32.1 I
2
S0/1 digital audio input/output
The I
2
S0/1 audio module provides a 3-wire digital audio interface that complies with the
I
2
S standard.
Remark: In the LPC3152/3154, the I
2
S0 interface is pinned out. The I
2
S1 interface is
internally connected to the analog die.
Fig 10. Audio paths block diagram
DECIMATOR
INTERPOLATOR
CLASS
AB
LPC3152/3154
HP_FCL
HP_FCR
HP_OUTR
HP_OUTL
I
2
S1 I
2
C1
I
2
CI
2
S
I
2
S0
HP_OUTC
DMUX
MUX_R1
MUX_R0
MUX_L0
SDAC
SDAC
AVC
I2STX_1
signals
I2SRX_1
signals
I2STX_DATA0
I2STX_BCK0
I2STX_WS0
I2STX_CLK0
ADC_MIC
ADC_VINL
ADC_TINL
I2SRX_DATA0
I2SRX_BCK0
I2SRX_WS0
MUX_L1
ADC_VINR
ADC_TINR
STEREO ADC
SADC
ANALOG DIE/AUDIO CODEC
002aae558
APB