Datasheet

DR
AFT
DR
AFT
DRAFT
DR
D
RAFT
DRAFT
DRA
F
T DRAF
D
RAFT DRAFT DRAFT DRAFT DRAFT D
DRAFT
D
RAFT DRA
F
T DRAFT DRAFT DRAFT DRA
LPC3152_3154 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Preliminary data sheet Rev. 0.12 — 27 May 2010 81 of 88
NXP Semiconductors
LPC3152/3154
13. Package outline
Fig 35. LPC3152/3154 TFBGA208 package outline
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT930-1
- - -
SOT930-1
05-12-08
06-01-03
DIMENSIONS (mm are the original dimensions)
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm
0 5 10 mm
scale
UNIT
mm
0.35
0.25
0.80
0.65
0.45
0.35
12.1
11.9
A
1
A
2
b E
12.1
11.9
D
ee
1
v
0.1510.4
e
2
10.40.65
w
0.05
y
0.08
y
1
0.1
A
max
1.15
ball A1
index area
D
E
B A
b
ball A1
index area
e
2
e
1
e
e
AC
B
∅ v
M
C∅ w
M
A
B
C
D
E
F
H
K
G
J
L
M
N
P
R
T
U
2 4 6 8 10121416
1 3 5 7 9 11 13 15 17
C
y
C
y
1
X
A
detail X
A
2
A
1