Datasheet

LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2.1 — 24 June 2014 52 of 80
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2] Applies to VDD_CORE pins.
[3] Applies to pins VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC.
[4] Applies to pins VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK, and VDD_PLLUSB.
[5] Applies when using 1.8 V Mobile DDR or Mobile SDR SDRAM.
[6] Applies when using 2.5 V DDR memory.
[7] Applies when using 3.3 V SDR SDRAM and SRAM.
[8] Specifies current on combined VDD_RTCx during normal chip operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and
VDD_CORE, VDD_IOx at typical voltage.
[9] Specifies current on combined VDD_RTCx during backup operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and all other VDD_x
at 0 V.
[10] Referenced to the applicable V
DD
for the pin.
[11] Including voltage on outputs in 3-state mode.
[12] The applicable V
DD
voltage for the pin must be present.
[13] 3-state outputs go into 3-state mode when the applicable V
DD
voltage for the pin is grounded.
[14] Accounts for 100 mV voltage drop in all supply lines.
[15] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
I
IH
HIGH-level input current V
I
= V
DD
; no pull-down
[10]
--1A
I
OZ
OFF-state output current V
O
= 0 V; V
O
=V
DD
;
no pull-up/down
[10]
--1A
I
latch
I/O latch-up current (1.5V
DD
) < V
I
< (1.5V
DD
)
[10]
--100mA
Table 8. Static characteristics
…continued
T
amb
=  40  C to +85  C, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit