Datasheet

LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 151 of 155
NXP Semiconductors
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Modifications: Temperature range for simulated timing characteristics corrected to T
amb
= 40 C to
+85 C in Section 11 “Dynamic characteristics”.
SPIFI timing added. See Section 11.15.
SPIFI maximum data rate changed to 52 MB per second.
Editorial updates.
Figure 25 and Figure 26 updated for full temperature range.
Section 7.23 “Serial Wire Debug/JTAG” updated.
The following changes were made on the TFBGA180 pinout in Table 3:
P1_13 moved from ball D6 to L8.
P7_5 moved from ball C7 to A7.
PF_4 moved from ball L8 to D6.
RESET
moved from ball B7 to C7.
RTCX2 moved from ball A7 to B7.
Ball G10 changed from VSS to VDDIO.
LPC4350_30_20_10 v.3.4 20120904 Preliminary data sheet - LPC4350_30_20_10 v.3.3
Modifications:
SSP0 boot pin functions corrected in Table 5 and Table 4. Pin P3_3 = SSP0_SCK, pin
P3_6 = SSP0_SSEL, pin P3_7 = SSP0_MISO, pin P3_8 = SSP0_MOSI.
Minimum value for all supply voltages changed to -0.5 V in Table 6.
LPC4350_30_20_10 v.3.3 20120821 Preliminary data sheet - LPC4350_30_20_10 v.3.2
Modifications:
Parameter t
wake
updated in Table 13 for wake-up from deep power-down mode and
reset.
Dynamic characteristics of the SD/MMC controller updated in Table 28.
Dynamic characteristics of the LCD controller updated in Table 29.
Dynamic characteristics of the SSP controller updated in Table 21.
Minimum value of V
I
for conditions “USB0 pins USB0_DP; USB0_DM;
USB0_VBUS”,“USB0 pins USB0_ID; USB0_RREF”, and “USB1 pins USB1_DP and
USB1_DM” changed to 0.3 V in Table 6.
Parameters I
IL
and I
IH
renamed to I
LL
and I
LH
in Table 10.
AES removed. AES is available on parts LPC43Sxx only.
Pin configuration diagrams corrected for LQFP packages (Figure 5 and Figure 6).
Figure 10 updated.
All power consumption data updated in Table 10 and Section 10.1 “Power
consumption”.
BOD levels updated in Table 12.
SWD debug option removed for Cortex-M0 core.
LPC4350_30_20_10 v.3.2 20120604 Preliminary data sheet - LPC4350_30_20_10 v.3.1
LPC4350_30_20_10 v.3.1 20120105 Objective data sheet - LPC4350_30_20_10 v.3
LPC4350_30_20_10 v.3 20111205 Objective data sheet - LPC4350_30_20_10 v.2.1
LPC4350_30_20_10 v.2.1 20110923 Objective data sheet - LPC4350_30_20_10 v.2
LPC4350_30_20_10 v.2 20110714 Objective data sheet - LPC4350_30_20_10 v.1
LPC4350_30_20_10 v.1 20101029 Objective data sheet - -
Table 42. Revision history
…continued
Document ID Release date Data sheet status Change notice Supersedes